#China #Suzhou #Edge AI #Longsys #mSSD

Longsys Achieves Major Production Milestone for mSSD Units

In a significant development for the tech world, Longsys, a renowned semiconductor memory enterprise, has officially announced the attainment of a remarkable production capacity of one million mSSD (Micro SSD) units per month. This achievement marks a pivotal moment for the company and signifies its commitment to meeting the surging demand for advanced storage solutions tailored for edge AI applications.

The journey to this milestone began in October 2025, when the first samples of mSSD were successfully produced at Longsys' state-of-the-art manufacturing facility in Suzhou, China. Through meticulous process optimizations and an increase in manufacturing capabilities, Longsys fine-tuned its production goals and reached this impressive output level by June 2026. This leap in production is not just about numbers; it's about fostering innovation in storage technology, particularly for edge AI applications.

Longsys has cleverly utilized System-in-Package (SiP) integration to redefine traditional storage formats, enhancing not just the performance and quality of its products, but also their functionality in real-world applications. The company’s mSSD solutions have undergone extensive validation, being used in cooperative projects with industry giants like Lenovo and ASUS.

The mSSD series includes advanced high-speed solutions based on PCIe Gen4 and Gen5 technologies. These products boast innovative thermal designs that ensure optimal performance while fitting compactly into various edge AI devices. Notably, the PCIe Gen5 model incorporates a vapor chamber cooling mechanism. This innovation allows it to manage higher bandwidth and capacity demands while maintaining peak performance in even the most intensive working conditions.

Longsys aims its mSSD products at a variety of applications, including AI PCs, intelligent terminals, and a range of edge AI devices. By employing a SiP architecture that integrates essential components such as controllers, NAND flash, power management ICs, and passive elements, the company maximally optimizes space and enhances reliability—all while shortening production cycles. This efficient production method enables Longsys to scale up its manufacturing processes rapidly without compromising on quality or reliability.

Moreover, Longsys has distinct advantages with its SiP integration technique. It provides compatibility across multiple high-speed PCIe specifications—ranging from Gen4 and Gen5 to the upcoming Gen6. Such adaptability ensures that Longsys' innovations are not only contemporary, but also future-proofed to meet evolving market demands.

To fortify its offerings, Longsys has also launched proprietary technologies such as SPU™ (Storage Processing Unit), iSA™ (Intelligent Storage Agent), and HLCache™ in March 2026. This holistic hardware-software architecture is designed to usher in the next generation of intelligent storage systems. Longsys is wholeheartedly committed to advancing its mSSD platform, paving the way for vital integrations across AI PCs, AI Boxes, and additional edge AI devices, all while progressing the PCIe Gen5 ecosystem.

By synthesizing cutting-edge SiP architecture with ongoing innovations in hardware and software, Longsys is poised to accelerate the large-scale deployment of edge AI storage solutions. This endeavor not only seeks to enhance efficiencies but also aims to unveil the vast commercial potential inherent in integrated storage technology. As it progresses, Longsys remains focused on its mission to empower technological advancements and explore the endless possibilities of edge AI applications.

About Longsys
Founded in 1999, Longsys has firmly established itself as a leading force in the semiconductor memory sector, recognized for its integration of research and development, design, packaging, manufacturing, and sales services. To learn more about Longsys, visit Longsys Website or connect with them on LinkedIn and Facebook.