#Taiwan #Zhubei #ERS electronic #Panel-Level Packaging #Zhubei Taiwan

ERS Electronic Opens Demonstration Center in Zhubei

On May 8, 2025, ERS Electronic, a leading provider of thermal management solutions for semiconductor manufacturing, announced the grand opening of its new demonstration center in Zhubei, Taiwan. This facility aims to meet the surging demand for panel-level packaging (PLP) technologies within the region.

The newly established demonstration center provides semiconductor manufacturers and OSATs (Outsourced Semiconductor Assembly and Test) in Taiwan direct access to ERS's cutting-edge PhotoThermal Debonding System, the LUM600S1. This strategic move comes as the PLP technology is gaining traction due to its cost advantages and scalability in production.

According to a report by Yole Group, the market for panel-level packaging is projected to grow significantly, increasing from USD 160 million in 2024 to over USD 600 million by 2030. This growth is largely driven by the demand for efficient solutions in advanced packaging, with high-density fan-out technologies anticipated to dominate the market, holding over 50% of the share by 2030. The trend towards larger form factors in the areas of chiplet and heterogeneous integration will propel the need for PLP as manufacturers aim to enhance chip density. Notably, the efficiency of carrier area in PLP can surpass 80%, a substantial improvement compared to the 45% efficiency achieved with traditional wafer-level packaging (WLP).

ERS has been at the forefront of PLP technology since its market introduction in 2018, when it launched its first debonder specifically designed for panel-level applications. Today, the company boasts an impressive portfolio of semi and fully automatic systems, including photo-thermal debonding machines essential for handling ultra-thin substrates crucial for high-performance computing (HPC) and artificial intelligence (AI) applications.

Sébastien Perino, Managing Director of ERS Taiwan, highlighted that the LUM600S1 provides a highly productive solution tailored for mass production of complex AI chips. Perino mentioned, “Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness.”

For those interested in learning more about the Zhubei demonstration center or the LUM600S1's testing and demonstration availability, they can visit the ERS website and connect with regional sales representatives.

About ERS Electronic

ERS Electronic GmbH, based in Germering, near Munich, has been a pioneer in innovative thermal management solutions for the semiconductor industry for over 50 years. The company has built a solid reputation, primarily through its fast and precise air-cooled thermal chuck systems used in wafer probing. In 2008, ERS expanded its expertise into the advanced packaging market. Today, its automated and manual systems for debonding and deformation compensation are utilized in the production facilities of major semiconductor manufacturers and OSATs worldwide.