#USA #Los Angeles #Optoelectronics #PhotonIC #ROCS

PhotonIC Technologies Launches New Product Portfolio

PhotonIC Technologies, a leader in the optoelectronic semiconductor industry, has announced the launch of a comprehensive product portfolio built upon its groundbreaking ROCS (Resiliency of Optoelectronic Chip Supply-Chain) platform. This innovative offering is designed to provide customers with enhanced control and predictability over various aspects of performance scaling, geopolitical risks, and manufacturing strategies.

ROCS Platform Overview

The ROCS platform uniquely integrates CMOS and SiGe processes, enabling the deployment and design portability across multiple fabrication facilities (fabs) situated in various favorable regions. This flexibility allows clients to fine-tune aspects such as speed, power consumption, customization, and overall costs, avoiding dependencies on a single manufacturing process, location, or supplier.

PhotonIC is set to showcase its latest offerings during the OFC 2026 event, taking place from March 17 to 19 at the Los Angeles Convention Center. The company will demonstrate a series of production-ready devices designed to cater to diverse needs in optical connectivity, sensing technologies, and high-speed applications.

Key Features of PhotonIC's Offerings

PhotonIC holds over 70 patents in high-speed optical connectivity, optical sensing, and automotive chipsets, having shipped more than 40 million integrated circuits (ICs) globally. With design wins projected to reach 100 million cumulative units by 2027, the company's products prioritize supply continuity and rigorous quality standards, serving Tier-1 clients such as Nokia, ST-Micro, On-Semi, and many others.

For engineers involved in the design of next-generation optical modules, PhotonIC presents itself as a one-stop shop, offering mass-production chips tailored to a wide range of optical module requirements. By combining CMOS technology for large-scale performance with SiGe technology for high-speed performance, the ROCS platform facilitates optimization of technological constraints alongside long-term sourcing strategies, pivotal for AI and cloud deployments.

The platform's versatility shines in applications requiring high-volume 25G and 100G cloud solutions, leveraging cost-effective CMOS for maximizing price-to-performance metrics while enhancing fab portability. Conversely, for advancing 400G, 800G, and 1.6T AI interconnects, PhotonIC employs advanced SiGe technology, specifically optimized for high-frequency performance.

Additionally, high-efficiency BCD-CMOS technology is utilized for External Laser Source (ELS) drivers within CPO (Co-Packaged Optics) systems, ensuring low-noise analog performance. The ROCS platform, grounded in mature, high-yield fabrication nodes and validated across multiple fabs, guarantees predictable performance and resilient supply chains.

Vision from Leadership

Dr. Frank Shi, CEO of PhotonIC Technologies, emphasized the significance of a synchronized approach to manufacturing and supply chain management stating, "Process, manufacturing, and supply-chain strategy can no longer be treated separately. Our ROCS platform integrates scalable, low-power CMOS with high-performance SiGe across multi-region manufacturing partnerships, strengthening supply resilience and enhancing customer confidence regarding delivery timelines and budget forecasts."

Upcoming Demonstrations

During the upcoming OFC 2026 event, PhotonIC will showcase exciting new products including:

• - 4×100Gb VCSEL transmitter and TIA receiver chipsets for linear pluggable optics (ready for mass production)
• - 1×25G and 4×25G CMOS-based solutions for VCSEL and DML applications (also mass production ready)
• - 4×100G redriver ICs designed for active copper cables (ready for mass production)
• - Low-power IDAC and PMIC chips for CPO applications (currently sampling)
• - 4×200G electrical IC designs set to enter mass production in the latter half of 2026

Moreover, the ROCS platform is adaptable for other optoelectronic markets, including time-of-flight systems, optical sensors, and LIDAR applications. Engineers and system architects attending the OFC in Los Angeles are encouraged to visit PhotonIC at Booth #5616 for live demonstrations and to discuss their design requirements.

For more information or to schedule a meeting, please reach out to [email protected] or visit www.photonic-tech.com.

About PhotonIC Technologies

PhotonIC Technologies is a fabless optoelectronic semiconductor designer with a global presence, including offices in Shanghai, Korea, Hong Kong, and Singapore. The company specializes in designing optoelectronic chipsets tailored for high-speed connectivity and sensing applications. Through its ROCS platform, PhotonIC enables scalable performance and operational resilience, offering competitive pricing across various domains, including AI infrastructure and cloud networking.