#USA #San Jose #InPsytech #UCIe 3.0 #Egis Technology

InPsytech Showcases Innovative 3nm UCIe 3.0 Technology

InPsytech, a notable affiliate of Egis Technology, is stepping into the spotlight at the Open Compute Project (OCP) Global Summit 2025, held from October 13-16 in San Jose, California. This leading technology company aims to propel innovation in the chiplet ecosystem with their latest demonstration of the 3nm UCIe high-speed interface technology, fully compliant with the new UCIe 3.0 standard.

Advancements in UCIe Technology

The focus of InPsytech’s latest developments is on high-speed and low-power interface intellectual property (IP). With its UCIe (Universal Chiplet Interconnect Express) portfolio, the company showcases cutting-edge advancements that span the spectrum of semiconductor technology, supporting process nodes down to an impressive 2nm, but optimized for 3nm production. The IP boasts data transfer rates reaching up to 64 GT/s, catering to modern demands for increased efficiency in chip-to-chip interconnections and heterogeneous integration.

The 3nm demonstration not only adheres to the latest UCIe 3.0 specification but also highlights InPsytech's prowess in leading next-generation process technology. It marks a significant leap forward in supporting the evolving requirements of chiplet designs and addressing the complexities faced by today's semiconductor landscape.

Collaboration with Alcor Micro

A noteworthy element of InPsytech’s participation at OCP 2025 is its collaboration with Alcor Micro Corp. Alcor's new Arm-based CPU platform, Mobius100 (CSS V3), will also take center stage at this summit. Built on the robust Arm Neoverse CSS architecture, this platform leverages InPsytech's UCIe technology to facilitate seamless die-to-die interconnects while allowing flexible integration with GPUs, NPUs, and various AI accelerators. This collaborative effort aims to fuel the evolution of heterogeneous computing and the overall chiplet design ecosystem.

David Hsu, COO of InPsytech, expressed the company’s pride in demonstrating their leadership alongside Alcor Micro. He emphasized the high potential of UCIe technology within the Arm Chiplet ecosystem while underscoring the optimism surrounding the future of chiplet adoption. Hsu noted, "We have strong confidence in the future of UCIe within the Arm Chiplet ecosystem and believe that InPsytech's UCIe technology will accelerate Chiplet adoption, bringing new innovation and breakthroughs to the global semiconductor industry."

Exhibition Details

During the OCP Global Summit, running from October 13–16, InPsytech's exhibit will be located in the Innovation Village Zone at the San Jose Convention Center. Attendees will be able to experience the groundbreaking 3nm UCIe 3.0 demonstration, showcasing features such as 3D package support, which further enhances the capabilities of chip interconnects. This exhibition stands as a testament to InPsytech’s commitment to fostering innovation in semiconductor technologies and advancing the capabilities of chiplet designs amidst a rapidly evolving market.

As the summit progresses, it offers an invaluable opportunity for industry leaders, innovators, and enthusiasts alike to delve into the future of computing technology, as InPsytech paves the way for revolutionary advancements in the chiplet ecosystem.