DEEP.FINE to Introduce Groundbreaking AI and XR Solutions at CES 2026

DEEP.FINE's Participation at CES 2026

As CES 2026 approaches, excitement is building around technological innovations set to be unveiled at the Consumer Electronics Show in Las Vegas. One of the standout participants this year is the XR spatial computing platform provider, DEEP.FINE, which will showcase its pioneering solution, the DEEP.FINE Spatial Crafter (DSC). This flagship platform aims to revolutionize industrial operations through the integration of Artificial Intelligence (AI) and Extended Reality (XR).

Scheduled from January 6 to January 9, DEEP.FINE's booth at the Las Vegas Convention Center, North Hall (Booth 9674), promises a unique experience for attendees eager to explore new advancements in industrial technology. The company aims to demonstrate how its DSC can facilitate 3D spatial creation using mere mobile devices, eliminating the need for expensive equipment, making it accessible for various enterprises.

Transforming Industrial Environments with DSC

DEEP.FINE has identified that much of the inefficiency in industrial environments arises from the fragmentation of data and workflows. The DSC serves as an XR-enabled strategic tool that seamlessly combines spatial data with real-time AI analytics, allowing businesses to build highly detailed 3D digital models of their operational spaces. These models bolster collaboration among teams and standardize their workflows, driving better decision-making based on spatial context.

Industries such as retail, logistics, construction, tourism, and public services are already experiencing the transformative effects of DEEP.FINE's solutions. Notably, logistics firms utilizing the DSC have reported significant improvements, including a remarkable 44% increase in picking speed and a 30% reduction in workforce requirements.

An Engaging Exhibit Experience

DEEP.FINE's exhibit is designed not only to showcase their technology but also to allow attendees to engage directly with its practical applications. Visitors will witness firsthand how the platform can enhance logistics and retail operations through real-world scenarios. For instance, they can experience advanced picking automation systems integrated with AR navigation tools, which guide employees through optimized movement paths, ultimately improving customer experience and operational efficiency.

Additionally, the booth will highlight how AR can be used for remote instruction, further enhancing training and workflow management in operational settings. Through spatial scanning and customer movement analysis, DEEP.FINE illustrates the power of digital twins in real time, demonstrating how these technologies work cohesively to support better business outcomes.

Expanding Horizons in Maintenance and Operations

Moreover, DEEP.FINE's applications extend to Maintenance, Repair, and Operations (MRO), an area that can greatly benefit from their advanced AI frameworks. The core capabilities of the DSC, including blueprint interpretation and real-time site recognition, provide vital support to industries focused on maintenance. This allows companies to streamline work processes and improve service delivery.

CEO's Vision for the Future

Hyun-bae Kim, the CEO of DEEP.FINE, envisions a future where spatial data plays a critical role in enhancing operational efficiency and competitive advantage for businesses. In his words, "Through CES, we plan to present how XR and AI technologies can be applied to on-site workflows across retail, logistics, construction, and manufacturing industries." He added, "The potential of spatial data as a key driver of business value is immense, and DEEP.FINE is committed to creating global partnerships that harness this potential."

DEEP.FINE's participation in CES 2026 underscores a significant step forward in the realm of industrial operations and presents a unique opportunity for attendees to explore the future of workplace efficiency. As companies continue to seek innovative solutions for enhanced productivity and competitive edge, DEEP.FINE stands ready to lead the charge.