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Ansys Thermal and Multiphysics Solutions Certified for Intel's 18A Process Innovations

Introduction
In a significant advancement for semiconductor technology, Ansys has successfully received certification for its thermal and multiphysics simulation tools tailored for Intel's 18A process technology. This development is particularly vital as the industry pushes towards complex applications associated with Artificial Intelligence (AI) and High-Performance Computing (HPC). The certifications underscore Ansys's commitment to innovation in the rapidly evolving semiconductor space.

The Driving Force: Advanced Certifications
The recent certifications signify Ansys’s dedication to delivering top-tier solutions in engineering design. The key highlights include:

• - Power Integrity: Ansys RedHawk-SC™ and Totem™ platforms are officially recognized, allowing for robust analysis and validation of power integrity across advanced semiconductor systems.
• - Multidisciplinary Thermal Analysis: The Ansys HFSS-IC™ Pro electromagnetic simulation software has also earned certification, ensuring that it can accurately model the intricate thermal behaviors of systems leveraging the new Intel 18A RibbonFET Gate-All-Around (GAA) transistors.
• - Cutting-edge EMIB Technology: Alongside Intel, Ansys supports the Embedded Multi-Die Interconnect Bridge (EMIB) technology enhancements which enable the development of multi-die 3D integrated circuits (3D-IC).

Collaboration with Intel Foundry
Strengthening their partnership, Ansys and Intel Foundry have collaboratively developed a comprehensive multiphysics signoff analysis workflow. This workflow integrates Ansys’s RedHawk-SC Electrothermal platform along with SIwave™ package electromagnetics simulation to ensure reliability in signal integrity and thermal performance during design validation. This collaboration not only enhances existing processes but prepares for future technologies such as EMIB-T, which is designed to incorporate through-silicon vias (TSVs) to further improve integration and performance of high-complexity microprocessors.

Looking Ahead: What’s Next?
The certification process for Ansys's tools like RedHawk-SC, Totem, and HFSS-IC Pro is presently ongoing for Intel 18A-P. This indicates a proactive approach to enable customers to kick off design work ahead of time using Intel's latest Process Design Kit (PDK).
Moreover, the joining of Ansys to the Intel Foundry Chiplet Alliance embodies a commitment to fostering an interoperable and secure ecosystem for designing multi-die heterogeneous systems, essential for future semiconductor advancements.

Expert Insights
As Suk Lee, VP and General Manager at Intel Foundry, explains, “Our approach to multi-die assembly is changing the way the industry thinks about stacking chips and designing for efficiency. Ansys tools are critical in this process because they help our mutual customers validate their designs with extreme accuracy — saving them costs that may not otherwise be recoverable.”

Meanwhile, John Lee, VP and General Manager at Ansys, highlighted that, “Our suite of multiphysics simulation tools instills confidence in our customers that their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity.”
This collaboration ensures that as technology evolves, both companies are equipped to provide the necessary tools and solutions to face upcoming challenges.

Conclusion
The certification of Ansys's tools for Intel's 18A process technology marks a pivotal step in advancing the capabilities of semiconductor designs aimed at supporting complex applications in AI and HPC environments. The ongoing collaboration between Ansys and Intel will drive innovation and pave the way for next-generation technologies, ensuring that their customers maintain a competitive edge in a swiftly changing technological landscape.