Sivers Semiconductors and Doosan Collaborate on Ka-Band SATCOM Antenna Panels
In a significant stride towards advancing satellite communication technologies, Sivers Semiconductors AB, recognized globally for its innovations in photonics and wireless technologies, has announced a collaborative effort with Doosan Corporation. This partnership aims to develop scalable electronically steerable array (ESA) panels operating in the Ka-band, tailored for satellite communications (SATCOM). The collaboration comes with a contract worth $1.5 million, intended to facilitate the design and development of sophisticated antenna systems powered by Sivers' forthcoming broad-market Ka-band SATCOM beamforming integrated circuits (BFICs).
Vickram Vathulya, CEO of Sivers Semiconductors, expressed the significance of this partnership, stating, "Our strategic collaboration with Doosan marks an important milestone for Sivers as we expand our footprint in the global SATCOM market." He further emphasized the capabilities of their Ka-band BFICs, which are designed for industry-leading efficiency and performance. This technology promises to deliver multi-beam, multi-orbit connectivity—an essential feature for the next generation of SATCOM systems. The enhancement of these systems will be significantly bolstered by Doosan's advanced manufacturing and system integration expertise.
Under the terms of the agreement, Sivers will utilize its high-performance Ka-band SATCOM BFICs that provide impressive transmit output power, minimal receive noise figure, and top-tier energy efficiency. These BFICs will allow for simultaneous multi-beam operations, enabling communication with several satellites across multiple orbits. A key feature of this technology is the 'make-before-break' handover, which guarantees continuous connectivity for both fixed and mobile SATCOM terminals. Additionally, Sivers will be developing the scalable ESA panels, leveraging its substantial in-house experience in designing large-scale antenna arrays.
In this initiative, Doosan will oversee the manufacturing and testing of the ESA panels, marrying its precision fabrication skills with Sivers’ cutting-edge semiconductor technology. This collaboration is poised to result in solutions that can be easily scaled—from compact, low-power terminals to robust, high-performance gateways—effectively catering to the ever-growing demand for adaptable, high-throughput SATCOM systems.
Harish Krishnaswamy, Managing Director of Sivers’ Wireless Business Unit, pointed out the advantages of partnering with Doosan, emphasizing, "This partnership allows us to enhance the development of scalable, energy-efficient SATCOM platforms based on Sivers' proven beamforming technology." He noted that Doosan’s engineering and manufacturing prowess makes them an ideal ally in this quest.
This partnership marks just the beginning of a broader collaboration between Sivers and Doosan aimed at fortifying Korea’s satellite communications infrastructure while expanding the reach of advanced antenna technologies on a global scale.
Sivers Semiconductors continues to position itself as a critical player in fostering a greener data economy through energy-efficient wireless solutions. The company’s differentiated high-precision laser and RF beamformer technologies empower customers in pivotal sectors, including AI data centers, SATCOM, defense, and telecommunications, to navigate essential performance challenges while supporting a sustainable footprint.
As for Doosan Corporation, it stands as a global figure in providing copper clad laminates (CCL), a fundamental component for advanced IC package substrates, along with printed circuit boards (PCB) for various electronic applications. The company has also been expanding into new business areas, including 5G mmWave communications, high-speed networking equipment, AI applications, and autonomous electric vehicles, and is actively preparing to deliver antenna modules for satellite communication, thereby reinforcing its role in transforming connectivity.
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