Compal Launches Innovative AI Server at CloudFest 2025, Ushering in a New Era of Data Center Efficiency

Compal Showcases Groundbreaking AI Server at CloudFest 2025



Compal Electronics has officially launched its innovative SG720-2A/OG720-2A AI server at CloudFest 2025, which took place from March 17 to 20, 2025, in Rust, Germany. This transformative product marks a significant progression in the field of data centers, focusing on high efficiency and energy-saving capabilities. By integrating advanced GPU acceleration with cutting-edge cooling technology, Compal aims to redefine how data centers operate.

Specifications and Features


The SG720-2A/OG720-2A stands out as a remarkable engineering achievement. This high-performance 7U AI server supports 8x AMD Instinct™ MI325X GPUs, which are built on the revolutionary CDNA 3 architecture. With an astonishing theoretical FP16 performance of approximately 20.9 PFLOPs and compatibility for over 41.8 PFLOPs in FP8 computations, it promises to deliver unparalleled computational power needed for large-scale AI inference and data processing.

To enhance its performance, the server boasts 2TB of HBM3E memory, which offers memory bandwidth of up to 48TB/s. This combination of high-speed memory and GPU acceleration offers a robust platform for intensive workloads and real-time data management.

Moreover, Compal has incorporated ZutaCore's HyperCool® 2-Phase Direct Liquid Cooling (DLC) technology into the server. This innovative cooling solution not only enhances computing performance but also stabilizes operational integrity, pushing the boundaries of what’s achievable in thermal management.

Design and Efficiency


Designed with a compact 850mm chassis depth, the SG720-2A/OG720-2A is engineered to fit seamlessly into standard EIA 19” racks or Open Rack v3 setups. This enhances its scalability and simplifies the management of complex data center arrangements. The server features front-facing, hot-pluggable I/Os, facilitating easy maintenance without the need to power down the entire system—thus maximizing uptime and operational efficiency.

Compal’s recent studies highlight the impressive efficiency of the SG720-2A/OG720-2A's cooling technology. In tests evaluating direct-to-chip liquid cooling methods, ZutaCore's HyperCool achieved a remarkable partial Power Usage Effectiveness (pPUE) of 1.01, outperforming conventional single-phase liquid cooling methods by 5% in energy efficiency metrics.

This groundbreaking approach sets a new standard for sustainable data center operations, marking HyperCool as a key factor in establishing eco-friendly computing environments.

The Future of Data Centers


At CloudFest 2025, Compal, in conjunction with ZutaCore, introduced additional pioneering technologies, emphasizing their commitment to lead in the field of data centers. This includes both the SG720-2A/OG720-2A server and other advanced systems tailored for AI and High-Performance Computing (HPC).

Attendees were invited to engage with Compal's offerings, showcasing their aspiration to remain at the forefront of technological advancement. The exhibition at Europa-Park, Germany, will help Compal reach potential clients and partners who are eager to explore the latest breakthroughs in AI technologies.

In conclusion, Compal Electronics stands as a formidable player in the intelligent tech landscape, continuously evolving since its inception in 1984. Its accolades, including recognition by CommonWealth Magazine as one of Taiwan's top six manufacturers, reflect its ongoing commitment to innovation and excellence. As the company expands into emerging markets, including cloud servers and automotive electronics, the SG720-2A/OG720-2A is poised to make a substantial impact in the future of data management and AI solutions.

Topics Consumer Technology)

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