#United States #San Francisco #Marvell Technology #OFC 2025 #AI Networks

Marvell Technology Showcases Advanced Interconnect Portfolio at OFC 2025

Marvell Technology, Inc. stands at the forefront of data infrastructure solutions, ready to unveil its innovative interconnect portfolio tailored for scale-up and scale-out AI deployments during the Optical Fiber Communication Conference (OFC) 2025. This prestigious event will take place from March 31 to April 3 in San Francisco, with Marvell showcasing its advancements in interconnect technology at booth #2129.

The demand for efficient interconnect solutions has grown dramatically as the global data infrastructure expands. An anticipated revolution in this sector is being driven by the need for enhanced performance and reliability in data transmission across modern AI networks. Recent projections from LightCounting suggest the market for interconnect chipsets could surge to $11.5 billion by 2030, highlighting the urgency for rapid innovation in this field.

Transformational Technologies for AI Applications

During OFC 2025, Marvell aims to highlight its strategic advancements in interconnect technologies, essential for meeting the escalating speeds, distances, and reliability required for AI and cloud services. The company's new approaches include:

• - Co-packaged optics (CPO) and co-packaged copper (CPC) technologies that enhance interconnect densities for sophisticated computing systems integrating large numbers of CPUs and XPUs spread across multiple racks.
• - Innovative networking solutions like 400G/lane networking, which will significantly boost the capacity of links to support extensive cloud-scale infrastructures while extending operational reach from meters to kilometers.

Product Innovations on Display

At the conference, Marvell will demonstrate several groundbreaking technologies, including:

• - 400G PAM4 Technology: A live exhibit of the industry's first complete electrical-to-optical link operating at 224 Gbaud, cementing a critical advancement toward future optical interconnects.
• - Co-Packaged Platforms for AI scale-up and scale-out, showcasing system-level implementations that emphasize rapid servicing and ease of manufacture while achieving higher interconnect densities.
• - The 1.6T Silicon Photonics Light Engine, presented in a reference design module, aims to enhance scale-up networks with capabilities of operating at 200G/lane.
• - 200G/Lambda 1.6T PAM4 Optical Interconnect, highlighting Ara, the first of its kind 3nm 1.6T platform with superior electrical and optical interfaces.
• - 800G ZR/ZR+ Pluggable Optics, demonstrated for multi-site AI training, allowing for exceptional data transmission distances and speeds.
• - PCIe Gen 6 and 7 SerDes End-to-End over optics technology, offering hands-on demonstrations of advanced retimer solutions.
• - A display showcasing a 51.2T scale-out fabric to illustrate the capabilities of Marvell's accelerated infrastructure for AI clusters, featuring various interconnect technologies.

Expert Insights and Discussions

In addition to product demonstrations, Marvell executives and technical specialists will participate in key discussions, panels, and workshops throughout the conference, focusing on important trends and challenges facing the industry. Attendees can explore the full agenda via Marvell’s official site.

About Marvell Technology

With over 25 years of experience, Marvell Technology has become a trusted leader in data infrastructure semiconductor solutions. The company prides itself on building powerful solutions through collaborations with its customers, focusing on serving the evolving demands of sectors including enterprise, cloud, and automotive. Marvell's focus on transparency and partnership drives innovation that will shape the future of technology.

For more information, visit Marvell's official website.

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