#None #Semiconductor #Manz Asia #SUSS

Strategic Alliance to Innovate Semiconductor Inkjet Solutions

In a significant development in the semiconductor industry, Manz Asia, a prominent player in semiconductor advanced packaging equipment, has recently announced a strategic collaboration with SUSS, a leading provider of equipment and process solutions in the same field. This partnership aims to explore and develop next-generation inkjet technologies for use in semiconductor manufacturing, with a specific focus on advanced packaging applications.

As the landscape of semiconductor manufacturing evolves towards higher levels of integration, the demand for greater process flexibility and material efficiency has never been more pronounced. Complex structures and large-format processing add layers of challenge for manufacturers, who are turning to innovative solutions like inkjet printing to meet these demands. Compared to traditional coating methods, inkjet technology provides precise and selective material deposition, significantly reducing waste and simplifying manufacturing processes.

Joint Exploration and Development of Inkjet Applications

The collaboration between Manz Asia and SUSS is set to delve into the development of new inkjet applications, material validation, and scalable manufacturing processes. Manz Asia brings its robust expertise in inkjet capabilities and manufacturing engineering. Their strong foothold in the panel-level packaging ecosystem is backed by a comprehensive inkjet development platform that spans everything from material and substrate preparation to printing, curing, and process characterization.

SUSS, with its deep knowledge of semiconductor processes and a wide global reach, provides complementary capabilities that will allow both companies to systematically enhance processes, accelerate developmental timelines, and tailor solutions specifically for semiconductor applications. This collaboration aspires to shorten time-to-market for new technologies, enabling a smoother transition of inkjet technology from advanced process development to high-volume semiconductor manufacturing.

The Vision Behind the Partnership

According to Burkhardt Frick, CEO of SUSS, the successful commercialization of new semiconductor technologies hinges on strong process expertise, exceptional application knowledge, and alignment with customer timelines. The partnership between SUSS and Manz Asia represents a strategic move to combine their strengths—SUSS's semiconductor process expertise with Manz Asia's inkjet specialization—thus facilitating faster technology development and improving access to the rising panel-level packaging market. Frick highlights that such collaborations underpin SUSS’s Ambition 2030 strategy, enhancing their technology portfolio and capabilities in advanced packaging while tapping into fast-growing semiconductor markets.

On the other hand, Robert Lin, CEO of Manz Asia, underscores the transition phase in panel-level packaging driven by higher integration and complexity. He believes that the collaboration will unlock significant potential to expedite the rollout of innovative inkjet technology, thereby fulfilling the increased demands of the semiconductor industry. Lin indicates this partnership is vital for achieving scalable, next-generation solutions both for advanced packaging and future semiconductor applications.

About Manz Asia and SUSS

Manz Asia specializes in delivering semiconductor equipment and solutions that utilize key technologies including Electrochemical Deposition (ECD) and digital printing, which support advanced packaging and IC substrate processing. The company is committed to helping clients accelerate their time-to-market while ensuring high-quality yields in the rapidly evolving semiconductor sector.

Meanwhile, SUSS is known worldwide for its cutting-edge technology and precision engineering that meet the needs of the semiconductor industry. Its collaboration with industry partners and research institutes assures the development of solutions that contribute significantly to powering technology in high-performance computing and artificial intelligence applications.

As both companies embark on this strategic journey, they aim not only to enhance their respective offerings but also to redefine the future of semiconductor manufacturing through innovative inkjet technologies.