DB HiTek Expands European Market Presence at PCIM 2025
From May 6 to 8, 2025, DB HiTek will attend the PCIM 2025 in Nuremberg, which is widely recognized as Europe's largest trade fair for power semiconductors. This event presents a unique opportunity for the company to enhance its marketing efforts and showcase its advanced technologies to a wider European audience.
As a leader in the 8-inch semiconductor sector, DB HiTek plans to exhibit its latest innovations, particularly in the fields of Analog Power, Specialty CIS, and next-generation Silicon Carbide (SiC) and Gallium Nitride (GaN) power semiconductors. The company's focus will be on its cutting-edge SiC and GaN semiconductor processes, which are deemed vital for its future growth strategy.
In February 2025, DB HiTek successfully verified the foundational characteristics of its 8-inch SiC wafers through fully internal manufacturing processes. The company aims to improve productivity and reliability this year and plans to make the process available to its customers by the end of 2025. Furthermore, DB HiTek has developed a robust 8-inch GaN process featuring 650V High Electron Mobility Transistor (HEMT) characteristics and is set to complete its reliability validation within this year. Additionally, a specialized GaN Multi-Project Wafer (MPW) service will launch in October to assist customers in evaluating their products effectively.
Market research firm Yole Développement predicts that the global market for SiC and GaN power semiconductors will soar from $3.6 billion in 2024 to $7.6 billion by 2027, with an impressive annual growth rate of 27.6%. Given these robust growth predictions, DB HiTek’s participation in PCIM 2025 is crucial.
In a statement regarding their involvement, DB HiTek emphasized that this exhibition allows them to demonstrate their proven expertise in supporting Fabless clients and collaborating with global customers in the European market. Despite being a market leader in 8-inch analog and power semiconductor processes, DB HiTek’s customer base in Europe remains relatively small compared to other regions. Hence, the company seeks to leverage this event to strengthen its presence and forge new partnerships while enhancing relationships with existing clients.
Currently, DB HiTek produces chips in mass quantities for around 400 companies, having delivered a cumulative total of 6 million 8-inch wafers dedicated to analog and power semiconductor applications. The company has also established itself in the Specialty CIS process technology market, which includes X-ray sensors, Global Shutter technology, and Single-Photon Avalanche Diodes (SPAD), working collaboratively with various partners in mass production.
DB HiTek's semiconductor applications extend across diverse sectors, including mobile communications, consumer electronics, and industrial applications. Notably, there has been a significant increase in the company's share of chips dedicated to the automotive industry in recent years.
Overall, DB HiTek’s strategic participation in the PCIM 2025 is expected to propel the company toward deeper market engagement in Europe, aligning with its objectives to innovate and expand its product offerings in emerging technology trends.