#Japan #Tokyo #CMC Research #IC Manufacturing #Shigeo Koshibe

Upcoming Seminar on Semiconductor Manufacturing

CMC Research is excited to announce a live online seminar titled "Semiconductor Manufacturing Processes and Key Materials for Semiconductors" scheduled for October 2, 2026. This event will feature an enlightening presentation by Shigeo Koshibe, the CEO of iPack Co., Ltd.

Seminar Details

• - Date: October 2, 2026
• - Time: 1:00 PM to 4:30 PM (JST)
• - Location: Zoom (online)
• - Participation Fee:

- General: ¥44,000 (tax included)
- Newsletter Subscribers: ¥39,600 (tax included)
- Academic Rate: ¥26,400 (tax included)

Participants will delve into the intricate world of semiconductor production, gaining insights into both the overall manufacturing processes and the specific roles of essential materials used in various stages. This knowledge is increasingly vital as the demand for semiconductors grows in our digital age.

Seminar Highlights

During this seminar, attendees will:
1. Learn the fundamentals of semiconductor manufacturing – Understand the key processes involved in the production of integrated circuits (ICs).
2. Gain insights into Japanese technology in the semiconductor field – Discover the significance of domestic innovations and how they contribute to global markets.
3. Explore the possibilities for your own company's technology – Discuss the future developments in semiconductor materials and technologies.

Target Audience

This seminar is ideal for:

• - Professionals interested in the foundational technology of semiconductor manufacturing.
• - Individuals keen to learn about the materials involved in IC production.
• - Those eager to understand the advancements of Japanese technology (equipment and materials) in the semiconductor sector.

Topics to be Covered

The seminar will explore various segments of semiconductor manufacturing, including but not limited to:
1. Overview of Semiconductor Manufacturing Processes
- Introduction to the manufacturing flow, from raw materials to finished semiconductor products.
2. Front-end Processes and Related Materials
- Examination of wafer production and processing, including materials and their roles in each step.
3. Back-end Processes and Related Materials
- Overview of assembly techniques and the significance of packaging and sealing technologies.
4. Implementation Processes
- Discussion on circuit boards, types of materials used, and the equipment involved in assembly.

A Q&A session will conclude the seminar, providing attendees a chance to clarify their doubts and explore specific queries related to their work.

How to Register

To participate, please visit the CMC Research seminar page and complete your registration. After registration, a separate email will be sent with the link to the seminar.
🔗 Register here

Instructor Background

Shigeo Koshibe has an extensive background in semiconductor materials development, with over 200 articles, multiple seminars, and a wealth of experience in the industry since 1976. His contributions have significantly shaped the understanding of semiconductor packaging technologies, making his insights invaluable to attendees.

With the ongoing evolution of technologies centered around semiconductors, this seminar presents a unique opportunity to stay informed and connected in this dynamic field. Join us to enhance your knowledge and explore the vast potential that lies within the semiconductor industry!