#Taiwan #Taipei #AI Infrastructure #Compal Electronics #Exascale Labs

Compal and Exascale Unveil Cutting-Edge AI Infrastructure Solutions at COMPUTEX 2026

In a significant advancement for the tech industry, Compal Electronics, Inc. is set to showcase its next-generation integrated AI infrastructure solutions at COMPUTEX 2026. The event promises to be a landmark occasion, highlighting the company's commitment to evolving beyond traditional server manufacturing. Compal is making bold strides in the AI ecosystem by introducing comprehensive solutions designed to support the increasing demands driven by intensive AI workloads.

As AI workloads continue to grow, they impose greater requirements in terms of power density and thermal management. Recognizing this shift, Compal is positioning itself as a leader in providing fully integrated AI infrastructure solutions ready for deployment. These solutions cater not only to cloud service providers but also to large enterprises and expansive AI development centers.

A Strategic Partnership

Compal's collaboration with Exascale Labs significantly strengthens its capability to offer integrated data center infrastructure that encompasses computing, cooling, and power management. This partnership aims to address the emerging needs of customers who are looking for more scalable and robust AI solutions. Alan Chang, VP of ISBG at Compal, stated, "The infrastructure for AI goes beyond server performance; today's clients demand integrated solutions that encompass computing, cooling, and power."

At COMPUTEX 2026, attendees will witness a live demonstration at Compal's booth featuring an array of AI infrastructure components. This includes state-of-the-art AI servers like the OG231-2-L1 and SGX30-2, coupled with advanced liquid cooling technology designed for condenser distribution units (CDUs).

Through this showcase, the partnership with Exascale Labs will be further illustrated by the introduction of High Voltage Direct Current (HVDC) power architecture and modular data center technologies. These innovations emphasize how an integrated approach to computing, cooling, and power can accelerate the deployment of AI infrastructures while enhancing scalability and energy efficiency.

Tailored Solutions for Diverse Workloads

Compal is dedicated to helping clients customize their infrastructure implementations based on specific workloads, energy availability, and the unique requirements of their data environments. This tailored approach not only simplifies deployment but also expedites the time it takes to get services up and running. "We continue to observe a burgeoning demand for faster and more flexible AI infrastructure implementations," said Hoansoo Lee, CEO of Exascale Labs. "Our collaboration with Compal enables us to blend modular data center technologies and HVDC capabilities seamlessly with Compal's innovative AI server and cooling solutions, paving the way for next-gen AI infrastructures designed for high-density AI environments."

The demonstration of Compal's AI infrastructure will take place at booth M0804 during COMPUTEX 2026, marking a pivotal moment for innovation in the AI sector. As the lines blur between traditional IT infrastructure and AI-specific requirements, Compal and Exascale are poised to lead the charge toward a more integrated and responsive technological future.

About Compal Electronics

Founded in 1984, Compal Electronics has established itself as a global technology leader, focusing on providing innovative platforms for PCs, cloud servers, AI solutions, and intelligent devices for leading brands worldwide. For more information, visit Compal's official website.