Compal and Exascale: Pioneering Integrated AI Infrastructure Solutions
In an impressive display at COMPUTEX 2026, Compal Electronics, Inc. (TWSE: 2324) is set to redefine AI infrastructure solutions in collaboration with Exascale Labs. This partnership aims to deliver next-generation integrated AI solutions suitable for cloud service providers and enterprises alike. As artificial intelligence continues to drive the demand for higher power and cooling efficiencies, Compal is expanding its traditional server manufacturing focus to provide more comprehensive and deployment-ready AI infrastructure.
Compal's showcase will include an array of advanced AI server platforms, including the OG231-2-L1 and SGX30-2 models. Additionally, the exhibit will present the innovative Coolant Distribution Unit (CDU) for liquid cooling, alongside Exascale's cutting-edge Modular Data Center (MDC) and Solid-State Transformers (SST) based HVDC power architecture. This combination will illustrate how integrated compute, cooling, and power infrastructure can facilitate faster, scalable AI deployment while improving energy efficiency.
Alan Chang, Vice President of ISBG at Compal, emphasized the evolution of client demands, stating that AI infrastructure necessitates solutions that go beyond just server performance. The integration of Compal’s AI server and liquid cooling technologies with Exascale’s modular infrastructure allows customers to deploy solutions tailored to their specific workload and data center requirements. As he noted, this enhanced capability minimizes deployment complexity while accelerating time to service.
Meanwhile, Hoansoo Lee, CEO at Exascale Labs, acknowledged the growing demand for flexible, rapidly deployable AI infrastructure. By fusing modular data center design with Compal's capabilities, their collaboration aims to unveil a comprehensive AI infrastructure solution specifically engineered for high-density AI environments.
At the heart of the computations, Compal's systems are geared toward simplifying the critical balance between power availability and cooling requirements in sophisticated setups. They offer customized deployments based on various parameters such as workload intensity and existing data center layouts.
The excitement around Compal's AI infrastructure showcase, located at booth M0804, highlights the company's commitment to being at the forefront of AI technology. Attendees can expect to see firsthand how these breakthrough technologies can shape the future of AI deployment.
The innovative solutions presented at COMPUTEX 2026 reflect not only the capabilities and vision of Compal and Exascale but also signify a shift in how AI infrastructures are approached by enterprises globally. As technology progresses, collaborations like this play a pivotal role in meeting the increasing demands of AI workloads and sustainable infrastructure.
About Compal Electronics
Founded in 1984, Compal has established itself as a leading player in global technology, providing advanced PC platforms, cloud and AI servers, as well as innovative smart device solutions to major brands around the world. The company is at the forefront of technological evolution, constantly adapting to the ever-changing landscape of tech demands. To discover more about their considerable range of services and products, visit
Compal's official website.