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Compal and Exascale to Showcase Advanced AI Infrastructure

Compal Electronics, Inc. is set to make a significant impact at the upcoming COMPUTEX 2026. The tech giant will be unveiling next-generation integrated AI infrastructure solutions, showcasing its growing capabilities in AI servers, liquid cooling systems, and infrastructure integration for data centers.

The ever-increasing power density and thermal demands associated with AI workloads have prompted Compal to go beyond traditional server manufacturing. This evolution allows the company to provide AI infrastructure solutions that are not only integrated but also deployment-ready, catering specifically to cloud service providers, businesses, and large-scale AI processing centers.

In partnership with Exascale Labs, Compal is enhancing its ability to integrate computing, cooling, and power infrastructure into scalable AI data center deployments tailored to shifting client requirements. At their booth during COMPUTEX 2026, Compal plans to present a comprehensive showcase of AI infrastructures, which will feature advanced AI servers and liquid cooling technologies. Key platforms such as the OG231-2-L1 and SGX30-2 will take center stage, alongside the Coolant Distribution Unit (CDU) technology for efficient cooling.

Moreover, the collaboration with Exascale Labs will introduce innovative high-voltage direct current (HVDC) power architecture based on Modular Data Centers (MDC) and Semiconductor Transformers (SST). This will illustrate how integrated computing, cooling, and power infrastructure can aid clients in accelerating AI deployments while enhancing scalability and energy efficiency.

By merging rack-scale computing platforms with direct liquid cooling systems and flexible infrastructure integration, Compal empowers its clients to customize their deployments according to workload requirements, power availability, and specific data center environments. This capability minimizes deployment complexities and significantly speeds up the time to operational readiness.

Alan Chang, Vice President of ISBG at Compal, stated, “AI infrastructure is no longer just about server performance; clients now need integrated solutions that encompass computing, cooling, and power.” Chang further emphasized that by merging Compal's AI server technologies and liquid cooling systems with Exascale's modular infrastructures and HVDC capabilities, they are enabling clients to deploy scalable AI infrastructure more swiftly and effectively.

Hoansoo Lee, CEO of Exascale Labs, highlighted the escalating demand for more flexible and rapidly deployable AI infrastructures. “Through this collaboration with Compal, we are thrilled to combine modular data center technologies and HVDC power solutions with Compal's robust capabilities in AI servers and cooling systems to present a next-generation AI infrastructure solution tailored for high-density AI environments.”

The AI infrastructure display from Compal will be on exhibit throughout COMPUTEX 2026 at Booth M0804, showcasing cutting-edge technology that promises to revolutionize how businesses approach their AI infrastructure needs.

About Compal

Founded in 1984, Compal is a global technology leader, known for delivering PC platforms, cloud and AI servers, along with intelligent device solutions to leading brands worldwide. To learn more, visit Compal’s website.