#USA #San Jose #InPsytech #UCIe 3.0 #Egis Technology

InPsytech's 3nm UCIe 3.0 Technology Shines at OCP 2025

In a significant advancement in the semiconductor industry, InPsytech, a subsidiary of Egis Technology (6462.TWO), is making waves by presenting its latest 3nm Universal Chiplet Interconnect Express (UCIe) 3.0 technology at the Open Compute Project (OCP) Global Summit 2025. This groundbreaking event, taking place from October 13 to 16, 2025, at the San Jose Convention Center in California, attracts attention for its role in driving innovation within the chiplet ecosystem.

A Look at the 3nm UCIe 3.0 Technology

The highlight of InPsytech's participation at OCP 2025 is undoubtedly the unveiling of their high-speed UCIe 3.0 technology. This innovative solution offers support for the latest UCIe-3.0 standard, facilitates 3D packaging integration, and delivers unparalleled speed with minimized energy consumption. This demonstration emphasizes InPsytech's capabilities in advanced Front End (FE) technologies for chiplet interconnection, solidifying its pivotal role in Egis Group's broader semiconductor design strategy and heterogeneous integration initiatives.

InPsytech's UCIe portfolio includes support for advanced process nodes ranging from 22 nm down to an impressive 2 nm, specifically optimized for the 3 nm production process. The presented technology achieves staggering data transfer rates of up to 64 GT/s and is designed to effectively support both 2.5D and 3D packaging architectures. By enabling highly efficient chip-to-chip connections and heterogeneous integrations, the 3nm UCIe 3.0 technology illustrates InPsytech's leadership in next-generation process technologies and its commitment to the growth of the chiplet ecosystem.

Collaborative Efforts with Alcor Micro

A noteworthy aspect of InPsytech's exhibit is its collaboration with Alcor Micro Corp., a partner in promoting the Arm chiplet ecosystem. The UCIe technology has been successfully implemented into Alcor Micro's cutting-edge Arm-based CPU platform, Mobius100 (CSS V3), which will also be showcased during OCP 2025. This new architecture, based on Arm Neoverse technology, supports flexible connections between CPU cores, GPUs, NPUs, and various AI accelerators, facilitating advancements in heterogeneous computing and chiplet design.

As members of the Arm Total Design (ATD) program, both InPsytech and Alcor Micro are aligned in their goals to foster collaboration and innovation within the Arm chiplet ecosystem. David Hsu, the Chief Operating Officer of InPsytech, expressed pride in their leading partnership with Alcor Micro, indicating a strong belief in the future of UCIe in the Arm chiplet ecosystem. He emphasized the expectation that InPsytech’s UCIe technology will accelerate chiplet adoption and usher in new innovations and breakthroughs for the global semiconductor industry.

Event Details

The OCP Global Summit 2025 is set to provide a platform for tech enthusiasts, industry leaders, and innovators to explore the latest trends and technologies transforming the world of computing. Not only does this event facilitate idea exchanges among peers, but it also showcases game-changing innovations like InPsytech's 3nm UCIe 3.0 technology.

• - Event: OCP Global Summit 2025
• - Date: October 13 - 16, 2025
• - Location: San Jose Convention Center, California, USA
• - Exhibition Area: Innovation Village Zone
• - Demonstration: 3nm UCIe 3.0 (with 3D Packaging support)
• - Partner: Alcor Micro Corp.

As the significance of chiplet technologies continues to grow, InPsytech’s advancements promise to drive substantial progress in semiconductor innovation. The company’s commitments to sustainable development and integration of advanced technologies will undoubtedly play a crucial role in shaping the future landscape of semiconductor design and application.