Acceleronix and IDEMIA Launch Game-Changing IFPP Program at MWC26
During the Mobile World Congress 2026 held in Barcelona, Acceleronix and IDEMIA Secure Transactions announced the initiation of the In-Factory Profile Provisioning (IFPP) Early Access Program, a groundbreaking solution in the world of IoT. This initiative was made possible through collaboration with Tele2 IoT, heralding a new era for OEMs as they strive for efficiency in the manufacturing of connected devices.
The IFPP program is designed to provide manufacturers with a quantum-safe provisioning solution that allows them to preload connectivity profiles onto eSIMs during the production phase. This feature enables devices to be factory-ready, capable of connecting right out of the box, which simplifies the overall IoT connectivity lifecycle. The program is particularly promising for device manufacturers, as it allows for one single eSIM part number (also known as SKU) to be utilized.
Across various demonstrations at the MWC26 event, attendees witnessed firsthand how this innovative approach can transform manufacturing practices. By enabling OEMs to leave the production line with fully connectable devices, the IFPP program supports faster global scalability and simplifies operational tasks across factories of any size, from small-scale to high-volume production lines.
The strategic collaboration integrates Acceleronix's advanced platform and orchestration capabilities with IDEMIA's robust connectivity solutions, namely their IFPP-ready eSIMs and secure cryptographic binding. Furthermore, the partnership with Tele2 IoT enhances the overall proposition by offering comprehensive global IoT connectivity, ensuring devices remain connected securely and effectively.
Key Features of the IFPP Program
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Automated Provisioning: Simplifies the process of managing device connectivity.
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Real-Time Monitoring: Offers oversight of the connectivity lifecycle.
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Full Traceability: Ensures all devices can be accounted for throughout their operational life.
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Streamlined SKU Management: Reduces complexity, making it easier to manage inventory.
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Accelerated Time to Market: Devices can be quicker to market, driving competitive advantage.
Built on cutting-edge cryptographic standards and a quantum-safe design, this solution also ensures the protection of connectivity profiles even in secure environments. Its compatibility with future GSMA specifications, such as SGP.42, paves the way for supporting expansive IoT deployments, promising both scalability and security.
Gal Olshinka, the Director of Acceleronix, highlighted the significance of this launch, stating, “Our IFPP program showcases our leadership in eSIM technology and emphasizes our commitment to enhancing the IoT device lifecycle for scalable solutions.” Similarly, Philippe De Oliveira, Senior VP at IDEMIA, remarked that the program simplifies the manufacturing process for OEMs significantly. He added, “This is not a theoretical model; it is ready for industrial adoption today.”
Furthermore, Onur Kasaba, Managing Director of Tele2 IoT, expressed pride in collaborating with Acceleronix and IDEMIA, noting how the IFPP program creates a landscape where devices can be shipped directly from factories as ready-to-connect entities, greatly enhancing operational efficiency.
Experience IFPP at MWC 2026
Visitors to the MWC exhibition are encouraged to visit Acceleronix's stand to witness live demonstrations of the IFPP program. This exclusive opportunity allows OEMs and device manufacturers to join the IFPP Early Access Program, receive a trial kit, and be the first to implement factory-ready, quantum-safe connectivity solutions.
Acceleronix remains committed to being the trusted partner for global innovators, ensuring a seamless journey from concept to deployment in the IoT landscape. It effectively handles all facets, including design, connectivity, the lifecycle of SIM/eSIMs, AI, cloud integration, and compliance, thereby enabling faster launches and smarter scaling.
For further details, interested parties can visit
www.acceleronix.io.