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ERS Electronic's New Facility in Germany

On February 6, 2025, ERS electronic, a leading name in thermal management solutions for semiconductor manufacturing, announced the grand opening of its latest production and R&D facility in Barbing, near Regensburg, Germany. This new establishment also boasts a cutting-edge Competence Center dedicated to Advanced Packaging and Advanced Backend technologies.

This ambitious initiative marks a pivotal moment for ERS as it seeks not only to enhance its operational capabilities but also to reinforce the European semiconductor ecosystem. The new facility is specifically designed to facilitate the development and production of ERS's innovative Advanced Packaging equipment, which is essential for the evolving semiconductor industry.

The integrated Competence Center offers valuable resources for customers, providing direct access to ERS's extensive expertise. This includes hands-on testing and demonstrations concerning wafer and panel debonding, warpage handling, and measurement techniques. Such capabilities will significantly support customers in overcoming their manufacturing challenges, allowing them to innovate more efficiently.

Laurent Giai-Miniet, the CEO of ERS electronic, emphasized the significance of this opening, stating, "This facility reinforces our commitment to advancing semiconductor technologies while supporting our customers both in Europe and globally. By offering tailored demonstrations and expert guidance, we aim to shorten the time-to-market and enhance manufacturing efficacy."

Furthermore, Imre Kosa, the Site Manager for ERS Barbing, highlighted the strategic advantage of consolidating production, R&D, and the Competence Center under one roof. He articulated the importance of empowering partners with the necessary tools and knowledge to drive innovation and meet increasing industry demands. Kosa extended an invitation to partners and customers to explore the new facility and learn firsthand how ERS can assist in addressing their specific process challenges.

With this facility, ERS electronic aims to assert its notable role within the European semiconductor landscape, contributing to regional initiatives focused on bolstering competitiveness and enhancing supply chain resilience. The investment in this state-of-the-art facility aligns with ERS's vision to be at the forefront of technology and innovation in semiconductor manufacturing.

For those interested in scheduling a visit or learning more about the Competence Center's capabilities, ERS encourages reaching out to their regional sales representatives or submitting a visit request through their official website.

About ERS Electronic

ERS electronic GmbH operates from its base in Germering, a suburb of Munich, where it has been delivering pioneering thermal management solutions to the semiconductor sector for more than five decades. The company has built a formidable reputation for its precise air cooling-based thermal chuck systems, widely used in wafer probing. In 2008, ERS shifted its focus to the Advanced Packaging market, continuously evolving to meet the needs of semiconductor manufacturers and OSATs worldwide. Their systems for automatic and manual debonding and warpage adjustment are now essential components on production floors globally.

This advancement signifies not just a new chapter for ERS electronic, but a crucial step forward for the semiconductor industry in Europe as it seeks to adapt to ever-changing technological demands.