#Japan #Tokyo #Power Semiconductors #CMCR #WBG Technology

Seminar Announcement: Power Semiconductor Applications of Metal Particle Sintering Technology

Date and Time: July 9, 2025 (Wednesday), 13:30 - 16:30
Location: Online via Zoom
Organizer: CMCR (Chiyoda, Kanda Nishikicho)
Visit the CMCR website for more details.

On July 9, 2025, CMCR will host an enlightening seminar addressing the topic of "Application and Structural Reliability Evaluation of Power Semiconductors Using Metal Particle Sintering Technology." The session will be led by Professor Chen Dentong, a distinguished expert from Osaka University’s Institute of Industrial Science, specialized in flexible 3D integration.

Key Topics Covered in the Seminar

Participants of the seminar can look forward to gaining valuable insights on a range of subjects, including but not limited to:

• - Fundamental knowledge about next-generation power module structures and implementation techniques.
• - In-depth exploration of silver sintering and dissimilar material interface bonding technologies.
• - Design principles for high-heat-dissipating power module structures.
• - Reliability evaluation and degradation characteristics related to Wide Bandgap (WBG) power modules.
• - Structural design strategies for power modules that ensure low stress and high reliability.
• - Heat design considerations for electronic equipment implementation.
• - Analysis of 3D advanced semiconductor structures and Cu pillar bonding.

This seminar is ideal for professionals involved in the implementation of next-generation WBG power semiconductors, structural design, thermal design, and reliability evaluations of power devices and modules in electronic components and devices.

Seminar Details

Fee Structure:

• - General: ¥44,000 (tax included)
• - CMCR Newsletter Subscribers: ¥39,600 (tax included)
• - Academic Price: ¥26,400 (tax included)

Participants will receive comprehensive materials along with the seminar. This event will have a dedicated Q&A session, encouraging active discussions and inquiries.

Registration Process

To participate, please register through the CMCR seminar site where you can also find further details about the event. After completing your registration, a link for seminar access will be emailed to you. Note that recording of the session is strictly prohibited.

Seminar Program Overview

The seminar will cover several critical sections:
1. WBG Power Semiconductors
- Characteristics and structures of WBG power semiconductors.
- Latest development trends in WBG power modules.
2. Implementation Techniques for High Temperatures
- Lead-free solder and solid-liquid phase bonding.
- Metal particle sintering bonding techniques.
3. Silver Particle Sintering and Dissimilar Material Interface Bonding
- Features of silver particle sintering technique.
- New micron-sized silver particles and low-temperature sintering mechanism.
4. Reliability Evaluation of Power Module Structures
- High-temperature reliability assessment of silver sintered structures.
- Heat cycle degradation analysis of silver sintered bond structures.
5. Low Stress Generation in Power Module Structure Design
- Necessary elements for low-stress generation in design.
- The reliability of new low thermal expansion coefficient Ag-Si composite materials.
6. Development of High Heat Dissipation Power Module Structures
- Heat dissipation performance evaluation of all-silver sintering joints.
7. 3D Advanced Semiconductor Cu Pillar Bonding
- Introduction to 3D advanced semiconductor Cu pillar bonding technologies.

About the Instructor

Professor Chen Dentong has an extensive background in the field of power semiconductors and has contributed significantly through numerous publications and papers in advanced materials and engineering journals. His current research focuses on innovative sintering technologies for power modules, which is critical to sustainable and efficient electronic devices.

Don't miss this opportunity to advance your knowledge and network with industry professionals. We look forward to your participation!