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Introduction

On January 2, 2025, Ceva, Inc. unveiled its latest innovation, the Ceva-Waves Links200, a multi-protocol wireless connectivity platform that is set to revolutionize the landscape of Smart Edge devices. This powerful platform combines next-generation Bluetooth High Data Throughput (HDT) technology with IEEE 802.15.4, supporting Zigbee, Thread, and Matter protocols, thereby enhancing the capabilities of various connected devices.

Key Features

The Links200 boasts several key features that make it a standout choice in the competitive market of wireless communication:

• - Dual Bluetooth Mode: It supports both Classic and Low Energy Bluetooth modes, allowing for flexibility in application.
• - High Data Throughput: The platform provides a remarkable data rate of up to 7.5 Mbps, more than doubling the speeds of traditional Bluetooth. This is particularly beneficial for latency-sensitive applications, such as low-power audio streaming.
• - Comprehensive Integration: It includes an integrated RF, modem, controller, and software stacks, simplifying the design process for developers.
• - Advanced Audio Capabilities: The Links200 supports various audio formats, including Classic Audio, LE Audio, and Auracast Broadcast Audio, enhancing audio experiences in TWS earbuds, smart speakers, and home entertainment systems.
• - Accurate Ranging: With Bluetooth Channel Sounding, it offers precise and secure ranging capabilities, making it suitable for various applications that require accuracy.
• - Optimized Manufacturing Process: Built on TSMC's low power 12nm FinFET technology, Links200 is tailored for smart audio and AI applications, boasting superior performance while minimizing power consumption.

Enhancing Smart Edge Technology

The demand for faster, more efficient wireless connectivity is rapidly rising, particularly in the realms of IoT and wearable devices. The Links200 platform not only addresses this need but also supports concurrent multi-link communication through advanced coexistence schemes. This is crucial for the seamless interaction of multiple protocols in a complex Smart Edge environment.

Moreover, this platform strengthens Ceva's position in the AI SoCs market. By integrating with Ceva-NeuPro-Nano NPUs, the Links200 can provide enhanced compute intelligence, enabling more sophisticated applications in smart devices. This paves the way for innovations in consumer electronics, such as improved smart home devices, wearables, and automotive solutions.

Time-to-Market Advantage

Ceva's Links200 platform provides manufacturers with a significant advantage by minimizing the technological barriers and risks typically associated with developing complex, compute-intensive SoCs. As Tal Shalev, Vice President and General Manager of the Wireless IoT business unit at Ceva, stated, the Links200 enables customers to focus on innovation while ensuring their products meet the diverse needs of the market.

Conclusion

In summary, the launch of the Ceva-Waves Links200 marks a significant step forward in wireless connectivity technology. By facilitating the integration of multiple protocols and providing cutting-edge features, this platform sets the stage for a new era in Smart Edge product development. With its ability to support the growing need for efficient communication in audio streaming and IoT devices, Links200 is poised to enhance user experiences across a wide range of applications. As technology continues to evolve, Ceva leads the charge with innovative solutions that empower smarter, interconnected environments.

For more details, visit Ceva's official website.