DuPont Showcases Groundbreaking Circuit Materials for AI and 5G at Shanghai Exhibition

DuPont Showcases Groundbreaking Circuit Materials in Shanghai



In an ambitious move to further elevate the electronics sector, DuPont will unveil its latest advancements in circuit materials at the International Electronic Circuits Exhibition in Shanghai from March 24 to March 26, 2025. This exhibition aims to demonstrate how innovative materials can significantly influence the future of electronic devices, especially as technology evolves towards artificial intelligence, machine learning, and 5G connectivity.

DuPont has cultivated a robust portfolio of advanced circuit materials and solutions tailored for high-performance devices. The Global Business Director for Advanced Circuit Packaging at DuPont, Yuan Yuan Zhou, highlighted the current market demands for compactness, integration, and enhanced performance in devices powered by AI and cutting-edge technologies. At Booth #8A31 in the National Exhibition and Convention Center (NECC), DuPont's team will reveal how these materials address challenges in signal integrity and thermal management, key components for next-gen electronics and AI-driven devices.

As AI technologies proliferate, the requirement for efficient performance and reliability in electronics skyrockets. DuPont is equipped to meet these needs, leveraging its extensive experience in material science. The company's innovative products focus on optimizing high-end printed circuit boards (PCBs) while also addressing the challenging environments found in AI infrastructures and data centers, which have become critical in today's digital age.

The exhibition will highlight DuPont’s various product offerings, specifically engineered to cater to specific demands within the industry. One such product, the DuPont™ Circuposit™ SAP8000, utilizes state-of-the-art SAP metallization technology crucial for applications involving CPU and GPU chips in AI servers. This innovative solution provides low-roughness dielectrics alongside low dielectric constant and dissipation factor properties, all essential for achieving high-frequency and fine-line designs in PCBs.

Another pioneering solution that DuPont will showcase is the DuPont™ Microfill™ SFP-II-M acid plating copper. This advanced pattern plating solution is crafted to enhance pattern distribution across large AI chips, ensuring consistent performance critical for high-performance computing. By focusing on these specializations, DuPont reinforces its commitment to pushing the boundaries of what's possible in electronic materials and applications.

Additionally, DuPont is set to present its high-performance dry film photoresists, including the DuPont™ Riston® DI1600 and DWB8100M solutions. The DI1600 series is favored for its superior fine line adhesion and resolution, making significant contributions to the production of IC substrates. On the other hand, DWB8100M excels in fine copper pillar applications, showcasing advanced résistive characteristics and improving yield performance through impressive fine line and via resolutions.

DuPont’s commitment to research and technological advancements in circuit materials reveals their proactive approach toward navigating emerging trends in the industry. By facilitating discussions at their exhibition booth, DuPont’s representatives will offer insights on both technological advancements and the prevalent issues affecting the PCB market.

As a leader in material technology, DuPont contributes significantly to various sectors, ensuring that every product not only meets but exceeds customer expectations in quality and performance. By transforming the future of circuit materials, DuPont remains dedicated to paving the way for the next generation of electronics, illustrating the dynamic intersection of technology and innovation.

This exhibition is vital not just for those in the PCB manufacturing sector but also for any stakeholders invested in the cutting-edge advancements stemming from AI and 5G developments. By taking part in the discussions and demos at DuPont’s booth, attendees will gain invaluable insights into the future trajectory of electronic circuit advancements.

About DuPont


DuPont (NYSE: DD) stands at the forefront of innovation globally, providing a range of technology-based materials and solutions that are reshaping industries and everyday lives. More information about DuPont, including their extensive product offerings and innovations, is available on their official website www.dupont.com. Investors can access more specific insights in the Investor Relations section at investors.dupont.com.

Topics Consumer Technology)

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