GIGABYTE Showcases AI-Powered X3D Turbo 2.0 at CES 2026 for AMD Ryzen 9000 Series

GIGABYTE Unleashes Power with AI-Driven X3D Turbo 2.0

At CES 2026, GIGABYTE is primed to showcase its cutting-edge technology, designed to unlock the full potential of AMD’s Ryzen™ 9000 Series processors. The star of this launch is the X3D Turbo 2.0 mode, which employs advanced artificial intelligence to optimize performance dynamically in real-time, enabling users to surpass typical performance limits.

The X3D Turbo 2.0 technology, a synergy of sophisticated hardware and software, has been meticulously fine-tuned using vast datasets derived from real-world applications. This implies that from day one, users utilizing Ryzen™ 9000 X3D processors will experience optimized performance tailored to various workloads.

Highlighting Innovation: X870E AORUS XTREME X3D AI TOP

The flagship model, the X870E AORUS XTREME X3D AI TOP, epitomizes GIGABYTE’s commitment to delivering uncompromised performance. Designed for enthusiasts, this motherboard is compatible with DDR5 speeds exceeding 9000 MT/s, facilitating an outstanding memory bandwidth coupled with unparalleled stability.

Furthermore, its advanced thermal architecture incorporates the CPU Thermal Matrix, which effectively lowers the VRM and DDR temperatures by up to 8.5°C. Additionally, the DDR Wind Blade XTREME contributes to a reduction of approximately 9°C in memory module temperatures. An intensive workload? The M.2 Thermal Guard XTREME keeps SSD temperatures down by as much as 22°C, promoting sustained speeds and enhanced durability.

Aesthetic Appeal and Practicality

GIGABYTE is also enhancing its product lineup with innovative aesthetic options tailored for builders. The X870E AERO X3D WOOD introduces warm wooden textures, elegant leather straps, and intricate craftsmanship that lend a natural yet modern aesthetic to PC designs. This model serves not only as a powerful tool but also as a statement piece for creators within the industry.

Among its latest offerings, GIGABYTE has unveiled stylish additions to the PROJECT STEALTH series. The newly launched X870 and B850 AORUS STEALTH motherboards feature an inverted connector design which contributes to a clean, cable-free appearance, simplifying the assembly process for creators and gamers alike. This innovation provides users with greater freedom to express their personal style through their builds.

Experience GIGABYTE at CES 2026

GIGABYTE’s showcase at CES 2026 promises more than just impressive technology; it emphasizes the evolution of user-focused design and innovation. For a firsthand experience of these groundbreaking products, visitors can find GIGABYTE at booth #8519 in the LVCC North Hall. Exclusive media and VIP sessions will also be hosted in the Venetian Ballroom, rooms Lido 3004, 3005, and 3104, providing an in-depth look at GIGABYTE's latest offerings.

In an ever-demanding technological landscape, GIGABYTE continues to push boundaries, ensuring that their users have access to the latest and greatest advancements in computer hardware.

Conclusion

As GIGABYTE prepares to leave its mark at CES 2026, the integration of the AI-powered X3D Turbo Mode with Ryzen 9000 Series processors stands as a testament to engineering excellence. It’s a bold movement towards maximizing processor potential for gamers and content creators alike, paving the way for future advancements in computing technology.