#Singapore #E&R Engineering #ZEN Voce #GP Group

E&R Engineering Corp. at SEMICON SEA 2025

E&R Engineering Corp. is gearing up for a remarkable presence at SEMICON Southeast Asia 2025, happening from May 20-22 at the Sands Expo & Convention Centre in Singapore. With over 30 years in the semiconductor industry, E&R aims to unveil significant innovations in laser and plasma processing technologies that promise to take semiconductor manufacturing to new heights.

Strategic Partnerships

This year's exhibition will feature a collaboration with two distinguished partners, Zen Voce and GP Group. The joint exhibition underscores the combined expertise across various aspects of semiconductor technology, including front-end, packaging, and back-end processes as well as automation. This synergy is not just a collaboration but a strategic alliance that exemplifies the principle of “1 + 1 + 1 > 3,” emphasizing that their collective strength goes beyond their individual capabilities.

Featured Innovations from E&R Engineering

Among the cutting-edge solutions E&R will showcase is the Plasma Dicing technology, which is designed for ultra-fine die cutting, capable of achieving dice lanes between 10-30 μm. This innovation also includes a comprehensive dicing service that adapts to unique shapes, offering high precision consistency in dimensions and shapes - whether hexagons, circles, or more complex layouts.

Another highlight is the Fan-Out Panel Level Packaging (FOPLP), capable of handling large panel processes up to 700 × 700 mm. This solution integrates laser marking, cutting, plasma cleaning, and advanced de-smearing, ensuring remarkable warpage control of up to 16 mm. Features such as laser debonding and plasma dry etching enhance the process, allowing separation of glass carriers and panels with unrivaled accuracy.

E&R also leads the market in glass substrate solutions, offering high-productivity TGV drilling with a range of 600 to 1,000 VPS, achieving an astounding ±5 μm accuracy at 3σ. Their glass laser polishing techniques are designed for sidewall roughness control, coupled with precise laser beveling and defect detection capabilities using advanced Optical Inspection (AOI) systems.

In terms of advanced packaging, the company offers high-precision laser drilling for 2.5D and 3D ICs, operating at ±5 μm accuracy alongside high throughput multi-beam laser marking and thermal laser cutting solutions. This abundance of innovations reflects E&R Engineering’s commitment to driving the future of semiconductor manufacturing.

Join Us at SEMICON SEA 2025

Visitors and industry experts are encouraged to visit E&R Engineering's booth (#L2413) to explore these cutting-edge technologies and understand how E&R, along with Zen Voce and GP Group, are enabling the next generation of semiconductor manufacturing with enhanced precision, efficiency, and integrated solutions. Their ambitious goal is not merely incremental improvement; they aim to redefine the possibilities within the semiconductor landscape.

For more details about their participation, you can visit their official website. Let's witness how innovation in technology can pioneer remarkable advancements in one of the most dynamic and evolving industries today.