#Taiwan #Hsinchu #TSMC #M31 Technology #eUSB2 IP

M31 Technology Collaborates with TSMC on 2nm eUSB2 IP Innovation

M31 Technology Corporation (M31), a prominent provider of silicon intellectual property (IP), has recently made headlines by announcing its collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to advance their innovative eUSB2 PHY IP. This announcement comes as M31's eUSB2 solution achieves silicon-proven status on TSMC's 3nm process and completes tape-out for the upcoming 2nm process.

M31 has proudly been a part of TSMC's Open Innovation Platform® (OIP) IP Alliance since 2012 and has received the TSMC OIP Partner of the Year Award for seven consecutive years, acknowledging its commitment to excellence in technology development. In 2020, M31 first introduced its eUSB2 IP solution on the 7nm process node, which solidified its role as a leader in cutting-edge interface IP development. Following this success, M31 has expanded its portfolio to adapt to TSMC's evolving process technologies, embracing the 5nm, 3nm, and now the 2nm advancements to meet the increasing demand for AI-enabled smart devices.

Looking forward, M31 is already engaged in developing the next-generation eUSB2 Version 2.0 (eUSB2V2) PHY IP, with a strong focus on the 3nm and 2nm process nodes. This continued innovation underscores M31’s drive to stay at the forefront of technology in the semiconductor industry.

The eUSB2 IP solutions from M31 have received widespread adoption from leading global companies, particularly in high-end smartphone chipsets and AI-driven image processing applications. The investment in the eUSB2V2 IP is poised to enhance data transfer rates significantly while operating on a low-voltage interface bolstered by asymmetric bandwidth technology. This technological leap enables the transmitter (TX) and receiver (RX) to operate at differing data rates, significantly improving transmission efficiency. This feature promises to benefit embedded applications such as AI edge computing, smart surveillance, and advanced image processing chips.

In the eUSB2V2 realm, M31 enhances the I/O architecture based on the eUSB2 standard, supporting data transfer speeds ranging from 480 Mbps to 4.8 Gbps. The solution intends to provide a comprehensive eUSB2 platform for high-end system-on-chips (SoCs), optimizing not only power efficiency and performance but also design flexibility while maintaining full compatibility with existing USB 2.0 devices.

At the 2025 TSMC North America Technology Symposium, Scott Chang, CEO of M31, expressed enthusiasm about this partnership, emphasizing the success of M31’s USB PHY IP development and the ongoing collaboration with TSMC. He stated, "With a strong track record of successful USB PHY IP development and a long-term commitment to innovation with TSMC, M31's eUSB2 IP has demonstrated proven silicon success across TSMC's leading-edge process technologies. Our partnership exemplifies a shared vision for advancing IP innovation for next-generation chip designs, aimed at expediting our customers' time-to-market."

Additionally, Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC, remarked on the fruitful collaboration, stating, "We are pleased to collaborate with M31 in driving IP advancements to enable future products. By strengthening our collaboration with OIP partners like M31, we aim to fuel innovation in next-generation AI and high-performance computing applications with TSMC's industry-leading process technologies."

As M31 continues to innovate and expand its portfolio, the collaboration with TSMC is a vital step in addressing the growing needs of the semiconductor market, particularly as demands for advanced computing capabilities and efficiency continue to rise. The integration of eUSB2 technology into high-performance and AI-driven applications is set to make significant contributions to the landscape of modern chip design.