#Laser Technology #Malaysia #Kuala Lumpur #E&R Engineering #SEMICON SEA

Leading the Charge in Semiconductor Manufacturing

E&R Engineering (8027.TW) is set to make a significant impact at SEMICON Southeast Asia 2026, where the company will present its pioneering laser and plasma solutions tailored for the semiconductor industry. Scheduled from May 5 to 7, 2026, at the Malaysia International Trade and Exhibition Centre (MITEC), this showcase is anticipated to draw attention from industry leaders looking to enhance their manufacturing processes.

Groundbreaking Collaborations

In a strategic move to amplify its offerings, E&R Engineering has partnered with renowned companies Horng Terng Automation (HTA) and Group Up Industrial (GP). This collaboration aims to create a fully integrated turnkey solution that addresses the urgent needs in artificial intelligence (AI), chip packaging optimization (CPO), and next-generation manufacturing. This approach aligns with the demand for higher efficiency and precision in semiconductor production.

Innovative Solutions on Display

E&R will highlight several cutting-edge technologies during the event:

• - Laser and Plasma Advanced Packaging:

- High-precision laser drilling for 2.5D/3D Integrated Circuits (ICs), achieving a tolerance of ±5 µm and a B/T ratio of up to 90%.
- Multi-beam laser marking that offers ±25 µm accuracy and high throughput capabilities.
- Controlled thermal laser cutting processes tailored for various semiconductor applications.
- Microwave or RF Plasma cleaning for pre-underfill and surface activation, essential in ensuring optimal material bonding.
- Hybrid plasma solutions designed for high-efficiency dry etching, critical for intricate circuit patterns.

Automation Integration Service (AIS)

With over 30 years of expertise, E&R Engineering's Automation Integration Service (AIS) stands out as a customizable automation solution designed to meet complex requirements. By employing simulation-driven modeling, E&R integrates multi-vendor process modules into a streamlined and efficient system that enhances production capabilities. This system includes a unified user interface and a single service window to simplify operations for manufacturers.

Advanced Panel Processing

A focal point of E&R's technology is its comprehensive support for large panel processes, particularly Fan-Out Panel Level Packaging (FOPLP). This innovative total solution encompasses various critical processes: laser marking, cutting, descumming, plasma cleaning, and post-drill de-smearing, all while maintaining exceptional warpage control up to 16 mm. The process is further augmented by advanced techniques such as laser debonding and plasma dry etching, which facilitate the separation of glass carriers and panels.

As E&R Engineering prepares to showcase its profound advancements, it encourages attendees to visit Booth #1452 to witness the future of semiconductor manufacturing firsthand. The collaboration between E&R, HTA, and GP promises a new era of more precise and integrated solutions, propelling the semiconductor industry towards unprecedented efficiencies.

Event Details

• - Event: SEMICON Southeast Asia 2026
• - Location: Malaysia International Trade and Exhibition Centre (MITEC)
• - Dates: May 5-7, 2026
• - Booth Number: #1452

For additional information, visit E&R Engineering's Website. 

Join E&R Engineering at SEMICON SEA 2026 and be part of the revolution in semiconductor technology. This event represents a pivotal moment to explore how advanced laser and plasma solutions can enhance manufacturing processes, ensuring the semiconductor industry continues to thrive in an increasingly competitive landscape.