#USA #Las Vegas #GIGABYTE #AMD Ryzen #X3D Turbo

GIGABYTE's Game-Changer at CES 2026: Unveiling X3D Turbo Mode 2.0

At the highly anticipated CES 2026 event, GIGABYTE has set the stage for innovation by unveiling its advanced X3D Turbo Mode 2.0, designed to fully harness the capabilities of the AMD Ryzen™ 9000 Series processors. This cutting-edge technology, powered by artificial intelligence, promises unprecedented performance enhancements for computing enthusiasts and professionals alike.

Enhanced Performance Through AI

The X3D Turbo Mode 2.0 is not just a simple upgrade; it's a sophisticated performance tuning solution that adapts in real-time to the computing demands placed on the processors. By utilizing vast datasets collected from real-world applications, GIGABYTE’s approach merges hardware and software in a seamless manner, ensuring that users can achieve maximum efficiency and performance from their Ryzen processors without any manual adjustments. This innovative feature unlocks previously unattainable performance levels, pushing the limitations of CPUs beyond conventional thresholds.

Cutting-Edge Hardware Supporting X3D Turbo Mode 2.0

Among the highlights at CES is the flagship motherboard, the X870E AORUS XTREME X3D AI TOP. This premium component is engineered for those seeking top-tier performance, supporting DDR5 memory speeds of up to an astonishing 9000+ MT/s. In practical terms, this means incredible bandwidth and stability for demanding applications and gaming.

The motherboard's advanced thermal architecture includes a smart thermal matrix, effectively reducing temperatures of the voltage regulation module and double data rates by as much as 8.5°C. Such features are critical for maintaining high performance during extended workloads, ensuring reliability and longevity.

Furthermore, GIGABYTE has also introduced the M.2 Thermal Guard XTREME, which can lower SSD temperatures by up to 22°C, safeguarding both speed and endurance under heavy processing loads. This level of thermal management is vital for gamers and content creators who push their hardware to the limits.

Innovative Aesthetic Designs

Keeping in mind the aesthetics of PC builders, GIGABYTE has launched modern designs that prioritize both form and function. The X870E AERO X3D WOOD model introduces warm wood grain textures and refined leather pulls, creating a natural yet contemporary look that appeals to users wanting to showcase their setups.

In addition, GIGABYTE expands its lineup with the sleek black iterations under the PROJECT STEALTH series. These motherboards, including the X870 and B850 AORUS STEALTH, feature an inverted connector layout that promotes a clean and cable-less appearance, further enhancing the assembly experience for builders and gamers.

Join the Excitement at CES 2026

GIGABYTE is eager to invite the tech community to explore these groundbreaking products firsthand at CES 2026. Attendees can visit GIGABYTE’s booth #8519 at the LVCC North Hall to experience the technology that is set to redefine performance standards in computing. Additionally, media and VIP sessions will be held at the Venetian Ballroom to provide further insights into these exciting developments.

As the landscape of computing technology continues to evolve, GIGABYTE remains at the forefront, promising a future where performance meets innovation seamlessly. Stay tuned for what comes next!