#Taiwan #Zhubei #ERS electronic #Taiwan Semiconductor #PhotoThermal debonding

ERS electronic Launches a Demonstration Center in Zhubei

In a significant move for the semiconductor industry, ERS electronic, a leader in thermal management solutions, has inaugurated a new demonstration center in Zhubei, Taiwan. This facility is poised to meet the increasing demand for panel-level packaging (PLP) technologies in the region, which has been gaining momentum due to its advantages in cost and process scalability.

The new center features access to the LUM600S1, ERS's cutting-edge PhotoThermal debonding machine designed for both wafers and panels. This demonstration center will allow chip manufacturers and OSATs (Outsourced Semiconductor Assembly and Test service providers) in Taiwan to explore how this technology can enhance efficiency and cost-effectiveness in their production processes. According to Dr. Yik Yee Tan, a principal analyst at Yole Group, the market for PLP is projected to expand from $160 million in 2024 to over $600 million by 2030, driven by advancements in cost-efficient solutions in advanced packaging.

Panel-level packaging has shown remarkable potential, particularly for complex AI chips and applications in High-Performance Computing (HPC). By 2030, it is expected that high-density fan-out technology, supported by Generative AI, will dominate the market, capturing over 50% of the market share.

The increasing demand for larger chip sizes, driven by Chiplet and Heterogeneous Integration markets, positions PLP as a solution that can achieve over 80% carrier area efficiency for sizes up to approximately 5.5 times the reticle size limit, significantly outperforming traditional wafer-level packaging that offers around 45% efficiency.

ERS electronic has been at the forefront of this technological advancement. They were among the first companies to introduce PLP equipment into the market, with their initial panel-level debonder launched in 2018. Today, the company provides a comprehensive range of semi- and fully-automatic systems, including PhotoThermal debonding machines that facilitate temporary bonding and debonding processes crucial for managing ultra-thin substrates. These processes are essential for critical applications in high-density computing and AI sectors, including Configurable Wafer-on-Wafer (CoWoS) technology.

Sébastien Perino, Managing Director of ERS Taiwan, stated, "With LUM600S1, we are delivering high-yield solutions specifically designed for high-volume manufacturing of intricate AI chips. Our Taiwanese clients will now have firsthand opportunities to see how PhotoThermal Debonding can enhance their operational efficiency."

For those interested in learning more about the Zhubei demonstration center and testing the LUM600S1, ERS electronic encourages potential customers to visit their website or contact the regional sales representatives for further details.

ERS electronic GmbH, headquartered in Germering, near Munich, has been a pillar in providing innovative thermal management solutions to the semiconductor sector for over 50 years. Their reputation stems from contributions such as fast and accurate air-cooling thermal chuck systems for wafer probing and their pivotal shift to the Advanced Packaging market in 2008. Today, their systems are integral to the production floors of leading semiconductor manufacturers and OSATs globally.