#USA #Los Angeles #GIGABYTE #CES 2026 #X870E AERO

GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026

At the CES 2026 event held in Los Angeles, GIGABYTE TECHNOLOGY Co. Ltd, a leading global manufacturer of motherboards, graphics cards, and hardware solutions, presented the X870E AERO X3D WOOD. This innovative motherboard signifies a substantial leap in combining high performance with an aesthetically pleasing design tailored for contemporary lifestyle-focused setups.

A New Aesthetic for Modern PCs

As PCs transition into open living and workspace environments, the X870E AERO X3D WOOD transforms computer hardware into a statement piece. Designed to bring warmth and sophistication to high-end configurations, this motherboard interlaces functionality with style. Its design draws inspiration from natural materials and modern interiors, featuring decorative accents reminiscent of wood and a premium leather tab, which enhances both the look and tactile experience that is uncommon in traditional PC components.

Targeting enthusiasts, creators, and gamers who value both aesthetics and performance, the X870E AERO X3D WOOD is not just a functional element within a PC build; it is designed to be a centerpiece. The marriage of form and function in this motherboard sets a new standard in the industry.

Top-Notch Performance Powered by AMD X3D

Beneath its elegant exterior, the X870E AERO X3D WOOD delivers exceptional performance without compromise. Built on the AMD Socket AM5 platform, it supports a range of Ryzen™ processors from series 9000 to 7000 and utilizes X3D Turbo Mode 2.0, enhanced by AI capabilities, to elevate performance further. It allows for DDR5 memory overclocking of up to 9000 MT/s, powered by a robust 16+2+2 phase digital VRM design that guarantees stable and efficient power supply.

To enhance expandability, the motherboard features two PCIe 5.0 slots for graphics cards and four M.2 slots compatible with PCIe 5.0/4.0 x4, enabling ultra-fast storage solutions.

Advanced Thermal Engineering with Elegant Integration

To maintain optimal performance levels, the X870E AERO X3D WOOD is equipped with a comprehensive thermal solution that balances efficiency with aesthetic appeal. Key thermal innovations include:

• - VRM Thermal Armor Advanced: Incorporating high-efficiency heat pipes.
• - M.2 Thermal Guards: Available in L and external models.
• - Thermal Plate PCB: This improves thermal performance by 14% while enhancing structural stability.

Next-Generation Connectivity and User-Friendly Features

The X870E AERO X3D WOOD doesn’t just shine in aesthetics and performance; it also offers cutting-edge connectivity options. It includes dual 5 GbE LAN ports, Wi-Fi 7, and two USB4 Type-C ports (both supporting DisplayPort Alt and HDMI). This motherboard also features several user-centered innovations from GIGABYTE, such as:

• - DriverBIOS: Comes with pre-installed Wi-Fi drivers for immediate network access.
• - M.2 EZ-Flex: A patented flexible base plate that enhances SSD cooling.
• - WIFI EZ-Plug: Simplifies antenna installation.
• - M.2 EZ-Latch Click Plus: Allows tool-free SSD installation.

For more details and to pre-order, visit GIGABYTE's official site.