DB HiTek Set to Showcase Innovations at PCIM 2026 in Nuremberg, Germany

DB HiTek, a prominent manufacturer specializing in 8-inch semiconductor chips, has revealed its exciting plans to participate in the upcoming PCIM (Power Conversion and Intelligent Motion) Europe 2026 event. Slated to be held in Nuremberg from June 9 to 11, this leading trade fair is pivotal for companies in the power semiconductor industry, and DB HiTek is eager to further enhance its presence in the European market.

After a successful debut at PCIM 2025, where they engaged in meaningful discussions with numerous clients about process technologies and potential collaborations, DB HiTek aims to leverage this momentum. Last year, the event attracted over 1,000 visitors to their booth, and the company has since initiated ongoing business talks that it expects to convert into fruitful partnerships this year.

At this year’s PCIM, DB HiTek plans to present its advancements in next-generation technologies including Silicon Carbide (SiC) and Gallium Nitride (GaN) processes. These materials are increasingly recognized for their superior efficiency and effectiveness in power management solutions. Additionally, DB HiTek will showcase its industry-leading BCDMOS (Bipolar-CMOS-DMOS) technology, which forms a cornerstone of their power management portfolio.

The outlook for SiC and GaN markets is particularly promising, according to market research from Yole Développement. The global market for SiC power semiconductors is anticipated to grow from approximately $4.8 billion in 2026 to $10.4 billion by 2030, marking an impressive compound annual growth rate (CAGR) of 21%. Likewise, the GaN market is projected to expand from $900 million to $2.9 billion within the same timeframe, representing a CAGR of 33%.

Since December 2025, DB HiTek has been running Multi-Project Wafer (MPW) runs for its SiC and GaN processes, producing samples for over ten customer products, with deliveries occurring between March and April 2026. Customer evaluations are currently underway, and feedback will be integral to final process validation. The company aims to initiate mass production of these technologies by 2027.

Currently, DB HiTek boasts mass production relationships with around 400 customers, focusing heavily on their premier power semiconductor products. The company not only collaborates with a diverse clientele but also integrates specialized image sensor technologies such as X-ray, Global Shutter, and SPAD (Single Photon Avalanche Diode) into their offerings. The mix of applications is progressively shifting towards industrial and automotive products, reflecting rising demand from these sectors.

With a commitment to innovation and quality, DB HiTek's participation at PCIM 2026 is anticipated to strengthen their ties within the European market, showcasing their commitment to advancing semiconductor technologies that drive efficiency and sustainability in multiple industries. As the event approaches, the semiconductor community eagerly awaits the unveiling of DB HiTek's latest technological advancements and its contribution to the future of power conversion and intelligent motion.