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Synopsys and Samsung: Innovation in AI and Multi-Die Design

Synopsys, Inc. has announced significant strides in its collaboration with Samsung Foundry, focusing on the development of advanced design technologies that cater to cutting-edge applications in edge AI, high-performance computing (HPC), and artificial intelligence (AI). The companies have successfully tape-out designs, showcasing their commitment to innovation in the semiconductor industry.

The recent accomplishments include a successful customer tape-out of HBM3 designs on Samsung's SF2 process, leveraging the Synopsys 3DIC Compiler. This innovative technology has significantly reduced turnaround times by tenfold, thereby enhancing the efficiency of the design process. Key innovations such as the AI-driven digital and analog flows have been developed for the SF2P process, allowing designers to accelerate the development of high-performance systems. These advancements exemplify a robust collaboration aimed at optimizing performance, power efficiency, and area (PPA) results.

Addressing Market Needs Through Collaboration

In an industry driven by rapid technological advancements, the demand for cutting-edge semiconductor technologies is more pressing than ever. John Koeter, senior VP at Synopsys, articulated this urgency, stating that developments in edge AI necessitate enhanced semiconductor capabilities that will lead to increased efficiency and broader AI applications in diverse fields.

The partnership between Synopsys and Samsung has thus been geared towards enabling complex designs for various devices, from sophisticated data center AI inference engines to highly efficient edge devices including cameras and drones — all designed with Samsung’s sub-2nm process technologies. This partnership not only strengthens each company's portfolio but also significantly benefits mutual customers who seek innovative, competitive solutions for their advanced designs.

Achievements in Multi-Die Design

Synopsys and Samsung have made substantial progress in multi-die design innovation. Their latest collaboration includes a successfully taped-out customer design, harnessing Synopsys' 3DIC Compiler integrated with Samsung's advanced I-CubeS 2.5D packaging technology. This cutting-edge approach allows numerous HBM stacked dies to be placed on a silicon interposer, drastically reducing routing time and enhancing performance and reliability as evidenced by a recorded 6% improvement in worst-case eye opening performance.

The integration of Synopsys’ tools and methods has facilitated greatly enhanced efficiency in early thermal analysis and 3D floorplanning, very much aligned with Samsung's advanced X-Cube technologies. Such advancements represent a new era of collaboration in the semiconductor field and set a standard for future innovations.

Design Technology Co-Optimization

For over a decade, Synopsys and Samsung have been cultivating their collaborative relationship to optimize designs via AI-driven design technology co-optimization. This method has proved invaluable, helping customers achieve superior PPA standards utilizing the SF2 and SF2P processes.

Additional advancements in AI-driven flows have led to the efficient migration of Samsung’s SF4 analog IPs to the SF2 process, along with certified digital flows providing further optimization for complex designs. These efforts are centered around the utilization of Synopsys’ AI-driven EDA suite, allowing faster development cycles for differentiated systems-on-chip (SoCs) across various industries.

A Broad Portfolio of IP Enhancements

Continuing their strategic collaboration, Synopsys and Samsung Foundry offer a robust portfolio of high-quality integrated circuit Intellectual Property (IP) designed for performance, efficiency, and minimal latency across Samsung's advanced process nodes. This partnership supports a broad spectrum of applications, spanning high-performance computing, consumer electronics, mobile devices, IoT, and automotive markets.

Synopsys’ extensive range of interface IP, which includes next-generation technologies such as 224G, UCIe, PCIe 7.0, MIPI, LPDDR6X, and USB4, complements the foundational IP that encompasses embedded memories and security solutions. By creating reliable, low-risk paths to silicon success tailored for Samsung’s processes, this collaboration significantly enhances the speed of market entry and strengthens competitive positioning for advanced design initiatives.

Conclusion

With its profound commitment to driving innovation and efficiency in semiconductor design, Synopsys is positioning itself at the forefront of the AI and multi-die design revolution through its strategic partnership with Samsung Foundry. This collaboration not only reduces technological turnaround times but also delivers sophisticated, high-quality solutions that empower mutual customers to thrive in a fast-evolving technology landscape. For more information about Synopsys and its solutions, visit Synopsys.com.