Linktel Technologies Unveils Revolutionary 12.8T Liquid-Cooled Optical Module at OFC 2026
Linktel Technologies, a leader in optical transceiver innovation, is set to make waves at the upcoming OFC 2026 with its state-of-the-art 12.8T XPO liquid-cooled optical module. As the demand for data processing in next-generation data centers escalates, Linktel’s innovative module promises to provide high efficiency and management of thermal demands greatly.
The 12.8T XPO optical module boasts a remarkable 64-channel design, which facilitates a staggering front-panel density of 204.8 Tbps per rack unit. This represents a fourfold increase compared to existing 1.6T OSFP implementations. Such impressive capability allows for a 75% reduction in switch footprint—an essential feature as AI clusters spiral towards substantial GPU counts.
Furthermore, Linktel’s new design takes significant steps towards advanced thermal management. The XPO integrates a cold plate within a “belly-to-belly” configuration, which effectively lowers internal temperatures by 20°C to 25°C. This enhancement facilitates stable module operation with power requirements peaking at 400W.
The 12.8T XPO module exemplifies universal interconnect synergy, supporting compatibility with DR, FR, LR, SR, and ZR/ZR+ standards across various architectures. This versatility allows for seamless integration in different settings within high-speed data transmissions, catering to the diverse needs of modern data centers. Richard Xiao, VP of Product Marketing at Linktel Technologies, highlighted, “The evolution of AI workloads necessitates a fundamental shift in bandwidth and thermal density.”
As Linktel takes the lead as a founding member of the XPO MSA, the company remains devoted to pioneering innovative standards that keep pace with the rapid progression of technology.
At Booth #1219 during OFC 2026, attendees can witness live demonstrations of the 12.8T Liquid-Cooled XPO module. In addition to this, Linktel will showcase its 200G/lane 1.6T modules, 400G/lane Optical Engines, and the award-winning Dispersion Management modules—their wave of the future.
The OFC conference stands as a significant platform for industry professionals to explore new innovations in optical communications. With its long-standing reputation and commitment to excellence, Linktel Technologies promises to captivate visitors with its forward-thinking solutions for next-generation data infrastructures.
Established with operational centers and customer service offices in the USA, Singapore, Malaysia, and China, Linktel Technologies focuses on delivering high-quality products essential for high-speed optical I/O connectivity. From high-speed pluggable transceivers to optical engines, Linktel's expertise in ODM/JDM services contributes to its reputation as a reliable partner in the tech industry.
For further details regarding their product offerings, visit www.linktel.com.
Groundbreaking Features
The 12.8T XPO optical module boasts a remarkable 64-channel design, which facilitates a staggering front-panel density of 204.8 Tbps per rack unit. This represents a fourfold increase compared to existing 1.6T OSFP implementations. Such impressive capability allows for a 75% reduction in switch footprint—an essential feature as AI clusters spiral towards substantial GPU counts.
Furthermore, Linktel’s new design takes significant steps towards advanced thermal management. The XPO integrates a cold plate within a “belly-to-belly” configuration, which effectively lowers internal temperatures by 20°C to 25°C. This enhancement facilitates stable module operation with power requirements peaking at 400W.
Universal Compatibility
The 12.8T XPO module exemplifies universal interconnect synergy, supporting compatibility with DR, FR, LR, SR, and ZR/ZR+ standards across various architectures. This versatility allows for seamless integration in different settings within high-speed data transmissions, catering to the diverse needs of modern data centers. Richard Xiao, VP of Product Marketing at Linktel Technologies, highlighted, “The evolution of AI workloads necessitates a fundamental shift in bandwidth and thermal density.”
As Linktel takes the lead as a founding member of the XPO MSA, the company remains devoted to pioneering innovative standards that keep pace with the rapid progression of technology.
Event Highlights at OFC 2026
At Booth #1219 during OFC 2026, attendees can witness live demonstrations of the 12.8T Liquid-Cooled XPO module. In addition to this, Linktel will showcase its 200G/lane 1.6T modules, 400G/lane Optical Engines, and the award-winning Dispersion Management modules—their wave of the future.
The OFC conference stands as a significant platform for industry professionals to explore new innovations in optical communications. With its long-standing reputation and commitment to excellence, Linktel Technologies promises to captivate visitors with its forward-thinking solutions for next-generation data infrastructures.
About Linktel Technologies
Established with operational centers and customer service offices in the USA, Singapore, Malaysia, and China, Linktel Technologies focuses on delivering high-quality products essential for high-speed optical I/O connectivity. From high-speed pluggable transceivers to optical engines, Linktel's expertise in ODM/JDM services contributes to its reputation as a reliable partner in the tech industry.
For further details regarding their product offerings, visit www.linktel.com.
Topics Consumer Technology）
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