#USA #Fremont #YES #SkyWater #RapidCure

YES RapidCure Systems Chosen by SkyWater for Advanced Packaging

In a significant advancement for the semiconductor industry, Yield Engineering Systems, Inc. (YES) has announced that its RapidCure polymer dielectric curing systems will be integrated into SkyWater Technology's M-Series™ fan-out wafer level packaging (FOWLP) technology. This decision is pivotal as it aims to enhance the efficiency of semiconductor production processes, addressing the demands of modern electronics.

The YES RapidCure tool uses a cutting-edge combination of ultraviolet (UV) and direct thermal exposure technologies. This innovative approach notably reduces the cycle time of curing processes, which is vital for the rapid advancement in the manufacturing of semiconductors. Traditionally, curing processes for polymer materials would take several hours; however, RapidCure can achieve complete curing in under 20 minutes. This breakthrough accelerates the development and production of high-density chiplet-based devices that are essential for today's advanced technology needs.

The Role of Deca Technologies

The process for YES RapidCure is based on a unique license from Deca Technologies, a company recognized for its pioneering contributions to semiconductor packaging solutions. The synergy between YES and Deca enables SkyWater to implement state-of-the-art FOWLP practices that comply with the latest industry standards while enabling them to remain competitive in the reshoring of the semiconductor supply chain.

The integration of RapidCure tools is a part of SkyWater's broader strategy to optimize the curing of polymer materials required for advanced packaging methods. This technology allows for a substantial reduction in thermal budgets associated with the organic and inorganic thin films typically used in semiconductor front-end processing and packaging applications.

Enhancing Manufacturing Throughput

Bassel Haddad, Senior Vice President and General Manager of Advanced Packaging at SkyWater Technology, expressed enthusiasm about the partnership. He highlighted that YES's RapidCure technology plays a crucial role in enhancing cycle times in the curing processes, which subsequently allows for faster prototyping, improved reliability, and increased throughput in manufacturing.

Furthermore, Rezwan Lateef, President of YES, noted that being selected by SkyWater to support the ramp-up of M-Series FOWLP technology underscores the importance of RapidCure technology in a world that demands swift advancements in semiconductor processes. RapidCure addresses a broad spectrum of advanced packaging applications, including low-temperature polymer curing, adhesive curing, and various new fan-out techniques.

Impact on the Semiconductor Market

The implications of implementing YES RapidCure technology extend beyond individual companies. With the capability to rapidly cure high-standard materials, YES's innovation is set to redefine efficiency across the semiconductor supply chain. Tim Olson, CEO of Deca Technologies, emphasized the significance of RapidCure in achieving unprecedented breakthroughs in cycle time reduction. Such advancements are essential for the future of high-density heterogeneous integration in the semiconductor sector.

Conclusion

As the semiconductor industry evolves, partnerships like the one between YES and SkyWater are crucial in realizing next-generation solutions. The adoption of RapidCure technology represents a forward-thinking approach to tackling the complexities of modern semiconductor manufacturing. As YES continues to lead in differentiated technologies for materials and interface engineering, the growing global presence of the company showcases a commitment to advancing semiconductor packaging solutions.