Gates Expands Data Center Solutions with New ThermalCool™ 2100SS Pump
Gates Expands Data Center Solutions with New ThermalCool™ 2100SS Pump
Gates Industrial Corporation Ltd. has recently launched its latest innovation - the ThermalCool™ 2100SS Pump, a powerful addition designed to elevate the standards of cooling technology in data centers. As data center demands transition towards higher computing capabilities, this new pump offers solutions tailored for liquid-cooling systems.
The ThermalCool™ 2100SS is an exciting development as it integrates seamlessly into dense data center environments which have increasingly stringent space limitations. This compact pump is engineered to maximize coolant flow while occupying minimal space, specifically optimized for rack-mounted coolant distribution units (CDUs) that integrate directly within IT racks. This innovative design effectively addresses the rise in rack densities which poses significant challenges for traditional cooling equipment.
Why ThermalCool™ 2100SS?
Rebekah Headley, the general manager of data centers at Gates, emphasized that the pump was developed as an engineering partnership addressing the intricate challenges posed by modern data centers. As computing power continues to be packed densely into each rack, existing pumping technologies often fail to meet these infrastructure needs. In response, the ThermalCool™ 2100SS was crafted to cater to these evolving requirements, ultimately positioning Gates as a critical player in the cooling solutions market.
Key Features of the ThermalCool™ 2100SS Pump:
- - High Performance in a Compact Footprint: Achieves an impressive output of up to 200 liters per minute at a pressure of 3 bar, all within a 4U-compatible form factor.
- - Self-Cooling Architecture: With its unique motor design, this pump eliminates the need for separate cooling circuits or fans by utilizing the coolant it circulates for active cooling.
- - Durable Engineering for Data Center Reliability: Built with stainless steel and OCP-compliant materials, it ensures long-lasting performance with a remarkable operational life expectancy of 50,000 hours.
- - Flexible and Scalable Integration: The device is designed with configurable connections and mounting options, allowing it to adapt to varied CDUs. It supports parallel operation, thus providing N+1 redundancy, a crucial feature for maintaining seamless uptime.
- - Advanced Communication Protocols: Equipped with CANBUS and MODBUS support, the ThermalCool™ 2100SS can easily integrate with existing monitoring and control systems.
Through these advancements, Gates establishes a broader capability within the data center cooling loop, supplementing their existing product offerings of hoses, fittings, and engineered assemblies. The combined strengths of these technologies enable Gates to enhance the fluidic path from coolant circulation through to rack-level interconnections, significantly bolstering operational efficiency in high-density computing environments.
The ThermalCool™ 2100SS Pump is anticipated for global availability starting early 2027. As businesses continue to evolve and the demands for innovation in cooling technologies increase, Gates remains committed to leading the charge in engineering solutions that meet and exceed market expectations. For further details, visit Gates’ Data Center Pumps Innovations page, where you can also connect with an engineer or request a sample.
About Gates Industrial Corporation Ltd.
Gates is a respected global manufacturer renowned for its innovative power transmission and fluid power solutions. The company provides an extensive range of products across various markets, servicing sectors from harsh industrial environments to everyday consumer applications. With a presence in over 130 countries, Gates continues to push the boundaries of engineering excellence.
In conclusion, with the unveiling of the ThermalCool™ 2100SS Pump, Gates highlights its dedication to addressing the intricacies of modern data center demands, paving the way for more efficient, reliable, and effective cooling solutions for the future.
Topics Consumer Technology）
【About Using Articles】
You can freely use the title and article content by linking to the page where the article is posted.
※ Images cannot be used.
【About Links】
Links are free to use.