#USA #Shenzhen #PCBAIR #Glass PCB #AI HPC

PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing

PCBAIR, a leading PCB manufacturer, has recently introduced its state-of-the-art 8-layer Glass Core PCB manufacturing technology, marking a significant advancement for industries reliant on high-performance computing (HPC) and artificial intelligence (AI). This innovative approach utilizes the proprietary Through Glass Via (TGV) technology alongside multi-layer redistribution layers (RDL).

The primary advantage of these new glass substrates lies in their impressive signal integrity and thermal stability. As AI and HPC demand more from connectivity solutions, traditional organic substrates face limitations in interconnect density. PCBAIR’s solution addresses these challenges head-on, offering a competitive edge in the marketplace.

Designed specifically for AI accelerators, high-speed server applications, and optical transceivers, the newly launched 8-layer Glass Core PCBs feature exceptionally fine line widths and spacing. Production and customer evaluation are already underway, allowing companies to experience the improvements in performance that these new PCBs offer.

Enhanced Technical Features

The key innovations that make this glass core PCB technology exceptional include:

• - Precision TGV Technology: Achieving via diameters of less than 20 μm and a pitch of under 100 μm, PCBAIR’s design significantly enhances I/O density compared to standard organic offerings. This allows for more efficient vertical signal transmission, which is critical for current chiplet designs.
• - Optimized 8-Layer Stack-up: The symmetric build-up structure, typically organized as 3-2-3 or 4-Core-4, has been smartly engineered to manage internal stress. This architecture ensures outstanding flatness and minimizes warpage commonly encountered in larger organic packages during assembly processes, which are vital for large AI chipsets.
• - Improved Electrical Performance: The dielectric loss of the glass core material is notably lower than its epoxy-based counterparts (Df < 0.002). This reduction translates into a 15%–20% enhancement in signal transmission efficiency crucial for high-frequency applications, such as next-generation 112G and 224G SerDes links.
• - Thermal Management: The thermal expansion coefficient (CTE) of the glass core closely matches that of silicon dies. This compatibility significantly reduces stress on solder joints during thermal cycling, ensuring higher reliability for packaged devices.

These technology enhancements enable chip designers to bypass existing packaging bottlenecks. Consequently, this innovation permits greater performance scalability without the disproportionate costs often associated with traditional silicon interposers.

Industry Impact

Victor Zhang, the Chief Technology Officer of PCBAIR, stated, “We are proud to introduce our 8-layer Glass Core PCB capabilities, representing a practical leap forward in advanced packaging.” Recognized by major media outlets such as Forbes, Zhang emphasizes the shift from organic to glass cores as a pivotal innovation, providing robust support for demanding compute workloads and assuring precision and reliability for partners.

In addition to performance capabilities, PCBAIR's Glass Core PCBs are compatible with existing substrate assembly lines. This seamless integration supports smooth transitions for customers eager to adopt this glass-based technology. PCBAIR further offers a complete turnkey solution, effectively handling the complex manufacturing and assembly processes needed for glass substrates, thereby minimizing supply chain risks for clients globally.

About PCBAIR

Founded in 2014, PCBAIR has established itself as a leading provider of PCB manufacturing and assembly services, with a commitment to high-reliability electronics. With over a decade of expertise, the company delivers comprehensive solutions from rapid prototyping to mass production. Their services include PCB fabrication, component sourcing, and full turnkey assembly. Recognized for quality, PCBAIR is certified to IATF 16949, ISO 13485, and ISO 9001, and adheres to IPC-A-610 and J-STD-001 standards. The company also maintains full environmental and safety compliance through UL, RoHS, and REACH certifications.

For further information about PCBAIR and its innovative technologies, please visit www.pcbair.com.