#Italy #Rome #MZ Technologies #GENIO EVO #Chiplet Design

MZ Technologies Introduces GENIO EVO

MZ Technologies, a pioneer in the domain of 2.5D and 3D design solutions, has officially unveiled its latest innovation: the GENIO EVO. This new Electronic Design Automation (EDA) tool is set to revolutionize the chiplet and package design landscape, addressing some of the critical challenges faced in the realm of 3D Integrated Circuits (ICs).

The GENIO EVO tool was presented during a press conference in Rome, marking it as the first integrated chiplet/package EDA solution that targets two significant obstacles in pre-layout stages: thermal management and mechanical stress issues. This unveiling comes ahead of MZ Technologies' upcoming demonstration at the prestigious Chiplet Summit, scheduled for January 21-23, 2025, at the Santa Clara Convention Center.

Bridging Gaps in Design

The GENIO EVO tool is built upon the success of its predecessor, GENIO™, which was the first commercially available integrated chiplet/package co-design tool. Notably, it offers a comprehensive platform for system design that incorporates chiplet/die, silicon interposer, package, and PCB co-design functionalities. Such integration allows designers to meet essential area, power, and performance metrics effectively.

One of the standout features of GENIO EVO is its user-friendly graphical interface, which enables detailed thermal analysis and seamlessly integrates with existing commercial platforms and custom EDA flows through its dedicated plugins. By embedding itself within any design flow, the tool ensures that design choices are optimized at the architecture level, facilitating the implementation of complex 2.5D or 3D multi-die designs.

MZ Technologies emphasizes that the new tool promotes efficiency in the design process, promising a streamlined methodology that covers interconnect management in intricate multi-fabric system designs. Enhanced identification and analysis of potential thermal and mechanical failures mean that designers can perform in-depth architectural exploration and scenario analysis during early design phases. This proactive approach allows teams to anticipate challenges and avoid costly downstream issues, ultimately speeding up the design cycle and improving manufacturing yields.

Tackling Thermal and Mechanical Challenges

In the world of 3D-packaged heterogeneous semiconductor devices, thermal and mechanical stresses pose significant challenges. Uneven heat distributions during operation can cause warping and reliability failures, which is why effective thermal management strategies are crucial. The GENIO EVO tool comes equipped with advanced thermal management features designed to minimize temperature variances and ensure the optimal performance of the integrated chiplets.

Moreover, mechanical stress issues arising from thermal expansion mismatches and substrate flexing could lead to interconnect failures or delamination. MZ Technologies positions GENIO EVO as a robust framework that proactively addresses these design challenges, ensuring structural integrity across a range of operational conditions.

A New Era in EDA Tools

Anna Fontanelli, the founder and CEO of MZ Technologies, highlighted, "We were the first EDA company to introduce a co-design tool in the market, and now with GENIO EVO, we are proud to offer the first solution that anticipates and resolves thermal and mechanical failures before design revisions are necessary."This advancement marks a new era in the EDA landscape, promising not only to enhance design efficiency but also to foster better communication among cross-functional teams—ensuring that components from diverse design environments can be imported seamlessly.

With the unveiling of GENIO EVO, MZ Technologies continues its mission to conquer the complexities associated with next-generation electronic products, further solidifying its position as a leader in innovative EDA software solutions.

The GENIO EVO tool is now available for immediate licensing, ushering in a new chapter for designers in the rapidly evolving semiconductor industry. To learn more about this groundbreaking technology, visit MZ Technologies.