Longsys Unveils Groundbreaking Embedded Storage Solutions for Enhanced AI Performance at MWC 2026

Longsys Innovations at MWC 2026



At the Mobile World Congress (MWC) 2026 held in Barcelona, Longsys (301308.SZ), a leader in branded semiconductor memory, introduced its latest integrated storage solutions aimed at advancing embedded artificial intelligence (AI) technology. The company's theme for this year's appearance, "AI Storage for the Mobile World," underscores its commitment to enhancing AI functionalities across diverse mobile devices including smartphones, wearables, and PCs.

Addressing Storage Demands


As AI-enabled devices evolve rapidly, the requirements for their storage technology also increase. Longsys recognizes this need and has developed innovative solutions that not only enhance performance but also optimize power consumption. Their integrated approach bridges software and hardware, ensuring that AI applications function seamlessly.

One of the standout features unveiled at the event was Longsys's proprietary High Level Cache (HLC) technology. This breakthrough allows UFS (Universal Flash Storage) to manage data traditionally stored in DRAM, thereby reducing DRAM dependency and manufacturing costs while maintaining user experience. Additionally, the integration of pTLC technology in their UFS lineup intelligently switches between QLC, TLC, and SLC modes through firmware, offering enhanced data retention along with cost efficiency.

Versatile AI Storage Solutions


Longsys's portfolio for mobile AI devices highlights several high-performance and economical storage options. The company showcased advanced solutions tailored specifically for AI applications in devices such as smartphones, tablets, and robots.

For wearables, which are experiencing significant growth, Longsys introduced the ePOP5x series, designed to meet the demands of smart glasses and smartwatches. This flagship product maintains the same footprint as its predecessor while achieving a remarkable 35% reduction in thickness—down to just 0.52mm. Furthermore, it doubles DRAM speed to an impressive 8,533 Mb/s and provides flexible capacity configurations, essential for the future of intelligent eyewear.

For PCs, Longsys introduced its mSSD storage solution that boasts low latency and high bandwidth capabilities to meet real-time data challenges. Their Lexar brand, known for high-quality storage solutions, showcased the industry’s first AI Storage Core architecture. This innovation supports flexible and large-capacity storage options, paving the way for products optimized for high-performance AI tasks.

Building an Integrated Ecosystem


Longsys is not merely providing storage solutions; it is evolving into a semiconductor company that integrates various elements of storage design. With comprehensive expertise in controller design, media RD, firmware development, and manufacturing processes, the company is focused on constructing a complete ecosystem for AI storage. This ensures its offerings are competitive and tailored to meet the diverse requirements of the embedded AI era.

Company Overview


Founded in 1999, Longsys has solidified its standing as a global leader in branded semiconductor memory. The company emphasizes innovation in memory technology and provides high-end, flexible, and efficient customized services to clients worldwide. Longsys’s vision, "Everything for Memory," reflects its dedication to advancing advanced memory solutions. More information can be found on Longsys's official website and on their social media platforms like LinkedIn, Facebook, and Twitter.

In conclusion, Longsys's participation in MWC 2026 sets a high bar for the future of integrated storage solutions, reinforcing its commitment to accelerating the capabilities of embedded AI across various platforms.

Topics Consumer Technology)

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