#Japan #Tokyo #Semiconductor Packaging #CMC Research #FPD Glass

Upcoming Online Seminar on Glass Technology

Join us on September 25, 2025, for a live Zoom seminar titled “Technological Trends and Development Directions for FPD Glass and Semiconductor Packaging Glass, along with Glass Processing Techniques, Strength, and Strengthening Methods.” This event is organized by CMC Research, known for its cutting-edge insights into materials and technology trends.

Event Overview

• - Date: September 25, 2025
• - Time: 1:30 PM - 4:30 PM (JST)
• - Platform: Zoom (with presentation materials provided)
• - Instructor: Dr. Joji Ito, President of Ito Device Consulting

Why Attend?

This seminar is designed for professionals involved in the development and manufacturing of glass substrates for flat-panel displays (FPDs) and semiconductor packaging. Attendees will gain essential knowledge about the latest trends, processing techniques, and methods to enhance the strength of these critical materials.

Learning Outcomes

Participants can expect to acquire valuable insights, including:

• - Historical development and composition trends of FPD Glass
• - Requirements and correlations between semiconductor packaging glass properties and FPD glass
• - Advances in glass processing techniques, especially drilling methods
• - Comprehensive understanding of glass strength and various strengthening methods

Who Should Attend?

This seminar is ideal for:

• - Professionals related to FPD glass
• - Individuals involved in semiconductor packaging glass
• - Those seeking knowledge in glass processing techniques
• - Engineers looking to understand glass strength better

Seminar Agenda

1. FPD Glass

1.1 Historical changes in glass substrate dimensions (area and thickness)
1.2 Evolution of glass composition
1.3 Trends and meanings of representative glass characteristics
1.4 Proposal of intermediary glass substrates

2. Semiconductor Packaging Glass

2.1 Requirements for shape and dimensions
2.1.1 Properties affected by warping (C.T.E., thickness, Young's modulus)
2.1.2 Comparisons with silicon wafer sizes
2.1.3 Surface smoothness and conductivity loss
2.1.4 Glass forming techniques
2.2 Proposed glass compositions and material characteristics
2.3 Electrical properties evaluation (dielectric constant and loss)
2.4 Comparisons between FPD glass characteristics with those proposed since 2010
2.5 Trends impacting packaging

3. Glass Processing Techniques

3.1 Mechanical processing (end mills and blasting)
3.2 Electrical discharge machining
3.3 Etching methods
3.4 Current proposals for processing techniques

4. Glass Strength and Strengthening Methods

4.1 Theoretical versus actual strength of glass
4.2 Evaluation of microcracks and mechanical strength
4.3 Methods for strengthening glass

5. Conclusion and Q&A Session

Engage with Dr. Ito during the Q&A session to further your understanding and application of the discussed topics.

Registration Details

• - Standard Fee: ¥44,000 (tax included)
• - Newsletter Subscribers: ¥39,600 (tax included)
• - Academic Rate: ¥26,400 (tax included)

To register, please visit the CMC Research seminar page, and upon registration, you will receive a viewing link via email.

For more details and registration, visit:CMC Research Official Site

About the Instructor

Dr. Joji Ito holds a degree in physics from Tokai University and has extensive experience in glass materials and their applications. He has worked with Corning Japan and led several committees in the industry. Dr. Ito represents the forefront of glass technology developments.

Join us for this informative seminar that promises to equip you with the knowledge and skills to thrive in the ever-evolving field of glass technology.