Boyd to Showcase Cutting-Edge Liquid Cooling Solutions at Data Centre World London 2026
Boyd Corporation, recognized globally for its innovative approaches in energy-efficient cooling technologies, is set to present at the esteemed Data Centre World London 2026. Scheduled for March 4-5 at ExCeL London, Boyd will showcase its advanced liquid cooling solutions tailored for artificial intelligence (AI) data centers, co-location environments, and hyper-scale operators. The presence of Ryan J. McGlen, Boyd's Chief Engineer, promises to add value to the event as he discusses the 'Cooling Circuit Architecture from Chip to Environment™', offering insights into the cutting-edge designs of liquid cooling systems for AI-driven data center architectures.
With the rising demand for high-density computing, Boyd's European participation positions the company as a leading regional partner in advanced cooling infrastructure. It combines large-scale manufacturing, top-tier engineering expertise, and lifecycle service capability to meet the needs of modern data centers. Boyd's liquid cooling systems are built to be highly reliable, quickly deployable, and seamlessly integratable, ensuring local support and service availability for data center operators.
In today's competitive landscape, data center operators are increasingly relying on liquid cooling technologies that not only enhance performance but also offer scalability. Boyd's systems are designed for next-generation computing, featuring regional design collaboration, commissioning expertise, and long-term maintenance support. This comprehensive approach significantly aids clients in minimizing risks, enhancing operational efficiency, and accelerating implementation processes.
David Huang, President of Boyd’s Thermal Solutions Division, stated, "Boyd possesses the necessary technology, engineering expertise, regional manufacturing scale, and comprehensive service framework to support liquid cooling implementations in the expanding European market. Our clients rely on us for dependable performance, agile collaboration, and the provision of comprehensive liquid cooling solutions, from conception and design through commissioning and ongoing maintenance all within the region."
Attendees of Data Centre World London are encouraged to visit Boyd at booth C193, where a team of experts will be on hand to discuss liquid cooling systems for AI and high-performance computing (HPC), system-level integration support, and Boyd's expanding capabilities in Europe.
Boyd is a trusted global innovator known for sustainable solutions that enhance the safety, speed, and reliability of clients' products. Their engineering materials and thermal solutions propel client technologies, aiming to maximize performance in the world's most advanced data centers while enhancing the reliability and autonomy of electric and autonomous vehicles. Additionally, Boyd optimizes precision in cutting-edge diagnostic systems and personal healthcare, supports high-performance aerospace and security technologies, and accelerates innovations in next-generation electronics and human-machine interfaces.
A core aspect of Boyd's global manufacturing is its deep commitment to environmental protection through sustainable, scalable, and strategically located regional operations that reduce waste and minimize carbon footprints. Boyd empowers its workforce, encourages individual potential, and inspires ethical responsibilities to drive customer success.