#USA #Los Angeles #Optical Transceiver #Eoptolink #12.8 Tbps

Eoptolink Introduces State-of-the-Art 12.8 Tbps Liquid-Cooled Pluggable Optics

In a significant development set to reshape the optical interconnect landscape, Eoptolink Technology Inc., Ltd. has unveiled the world’s first 12.8 Tbps liquid-cooled pluggable optics designed specifically for AI data centers. Announced on March 12, 2026, this groundbreaking product sets a new standard in data transmission,
leveraging liquid cooling to achieve unprecedented performance metrics.

The Game-Changing 12.8T XPO Product

The newly launched 12.8T XPO series optical transceiver boasts an impressive throughput of 12.8 Tbps, enabled by 64 lanes that operate at 200 Gbps each. This remarkable feature provides a front-panel density of 204.8 Tbps within a compact 4-RU rack configuration, signifying a fourfold improvement over existing 1.6T OSFP solutions. Such density not only enhances data transfer capabilities but also streamlines physical space utilization in data centers.

Advanced Cooling Technology

Eoptolink has ingeniously integrated a cold plate within the module, capable of supporting up to 400W of cooling per unit. This design is crucial for ensuring that the transceivers operate reliably within environments that demand high power output. The company recognizes that as network bandwidth requirements continue to grow, innovative solutions such as liquid cooling are essential for maintaining efficiency and operational integrity.

Sean Davies, Vice President of Sales at Eoptolink, emphasized the importance of this product by stating, "XPO modules address key challenges our customers and the industry are facing as network bandwidth requirements continue to scale. Liquid cooling enables higher-power optical modules while maintaining thermal efficiency, allowing for much greater port density. At the same time, front-panel pluggability preserves the serviceability and deployment flexibility that operators rely on."

Joining the XPO Multi-Source Agreement

In conjunction with unveiling this cutting-edge optical technology, Eoptolink has also joined the XPO Multi-Source Agreement (MSA) as a founding member. The XPO MSA represents an industry collaboration aimed at defining a new category of high-density, liquid-cooled pluggable optics. By contributing its extensive know-how in high-speed optical transceiver design and manufacturing, Eoptolink aims to foster the development and commercialization of next-generation optical interconnect solutions that will be pivotal for AI infrastructure and cloud data centers.

Upcoming Showcase at OFC 2026

Eoptolink is poised to showcase its innovative technologies, including the 12.8T XPO, 400G/lambda-1.6T DR4, and the 200G/lambda-1.6T FRO/LRO/LPO series of optical transceiver solutions at the OFC 2026 exhibition. Attendees can find Eoptolink at booth #1211 in Los Angeles, CA. This exhibition will offer visitors the opportunity to experience firsthand the performance capabilities of these advanced optical solutions.

About Eoptolink

Eoptolink Technology Inc., Ltd. stands at the forefront of optical interconnect solutions for various applications, including data centers, telecommunications, and enterprise networks. With a commitment to research and development, Eoptolink specializes in the manufacture and marketing of high-performance optical transceivers, contributing to advancements in sectors like AI/ML clusters, cloud data centers, 4G/5G wireless systems, and more. Their relentless pursuit of innovation positions them as a global leader in the optical technology arena.

In summary, the launch of the 12.8 Tbps liquid-cooled pluggable optics not only elevates Eoptolink's status as an industry leader but also represents a significant step towards meeting future demands in AI data center technology. As the data landscape continues to evolve, solutions like Eoptolink's XPO will be pivotal in driving the change needed for next-gen data networks.