#United States #3M #St. Paul #US-JOINT #Resonac

3M Joins US-JOINT Consortium to Propel Semiconductor Technology

In a significant move that underscores its ongoing commitment to the semiconductor industry, 3M has announced its membership in the US-JOINT Consortium. This consortium comprises 12 premier semiconductor suppliers dedicated to pioneering advancements in semiconductor technologies.

Collaborative Innovation Efforts

The consortium aims to accelerate research and development in advanced packaging and back-end processing technologies. This will be anchored by a cutting-edge facility set to be established in Silicon Valley, which is renowned for its robust tech ecosystem. 3M's involvement in this strategic partnership aligns with the increasing demand for innovative solutions driven by the rise of artificial intelligence and high-performance computing technologies. Steven Vander Louw, 3M's president of display and electronics product platforms, expressed that collaboration among suppliers is essential to meet these demands efficiently. He emphasized, "As the demands of AI and other high-performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines.”

A Legacy of Expertise

As a notable player in the semiconductor sector for over 25 years, 3M has built a reputation for supplying materials and processing aids critical for semiconductor polishing, advanced packaging, and chip transport. The company’s integration into this consortium further solidifies its status as a total solutions provider for the semiconductor industry. Vander Louw highlighted the importance of utilizing their decades of material science expertise, which spans over 50 technology platforms, to tackle the industry’s challenges.

Industry Leaders Unite

Founded in 2023, the US-JOINT Consortium is spearheaded by Resonac, a globally recognized leader in semiconductor and electronics materials. Resonac's Chief Technology Officer for semiconductor materials, Hidenori Abe, expressed enthusiasm about 3M's entry into the consortium. He reinforced that 3M’s extensive knowledge in materials science and dedication to innovation will significantly benefit the consortium’s goals. Abe stated, "3M's expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the United States.”

Looking Ahead: A New Facility

The US-JOINT Consortium's research and development facility is set to be officially inaugurated later this year, accompanied by a public launch event. This new establishment is expected to serve as a hub for driving advancements in semiconductor technologies and providing cutting-edge solutions for the market. Interested parties can find more information on semiconductor advanced packaging technologies by visiting 3M’s dedicated platform.

About 3M and Resonac Group

3M remains steadfast in its belief that science plays an essential role in creating a better world. By harnessing the power of innovation and collaboration, the company aims to address the diverse challenges faced by various sectors, thus enhancing lives around the globe. The Resonac Group, formed in January 2023, combines the strengths of the Showa Denko Group and the Showa Denko Materials Group, becoming a formidable entity in the semiconductor materials market with annual sales hitting approximately 340 billion yen. Resonac’s innovative approach and extensive product lineup in semiconductor back-end processes cement its position as a leader in the industry.

Together, through this strategic partnership, 3M and the US-JOINT Consortium aim to construct a resilient future for the semiconductor industry and tackle the universal technological challenges head-on.