#USA #San Jose #AI Infrastructure #LITEON Technology #OCP Global Summit

LITEON Technology Unveils Advanced 800 VDC Solutions at OCP Global Summit 2026

LITEON Technology, a key player in the tech arena, showcased its groundbreaking 800 VDC architecture and thermal management solutions at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, from October 12 to 15. This event is a significant gathering of leaders and innovators in the field of computing infrastructure, making it the perfect stage for LITEON to unveil its next-generation capabilities.

Key Highlights from the Event

Introduction to 800 VDC Architecture

At the summit, LITEON introduced a next-generation AI factory infrastructure portfolio centered around its 800 VDC power architecture. This new solution is particularly designed to support high-performance AI platforms like NVIDIA's Vera Rubin. The display prominently featured LITEON’s power rack solutions that integrate seamlessly with NVIDIA’s MGX and OCP ORv3 architectures.

Highlights of LITEON’s offerings included a 2.6MW Enterprise Cooling Distribution Unit (CDU). Developed in collaboration with DCX Liquid Cooling Systems, this unit boasts a remarkable heat transfer capacity of 2.6MW. It features an innovative design focused on maximizing cooling efficiency while maintaining reliability during high-density AI computing tasks. The CDU provides an approach temperature of only 3°C, an achievement indicative of cutting-edge thermal management technology.

Innovations in Power Solutions

For the NVIDIA Vera Rubin NVL72 platform, an integrated infrastructure solution was showcased, featuring an astonishing 95kW DC/DC Power Shelf and a 280kW Liquid-to-Liquid (L2L) In-Rack CDU. This combination effectively addresses the growing needs for power efficiency and reliability in AI infrastructures. By leveraging 800 VDC distribution alongside advanced thermal systems, LITEON aims to significantly minimize power losses and heat generation, thereby enhancing overall energy efficiency and freeing up space within AI deployments.

Insights from LITEON's Leadership

John Chang, General Manager of LITEON's Cloud Infrastructure Platform and Solution SBG, emphasized that in the AI era, efficiency in power conversion is paramount. “The measure of a data center’s competitiveness has evolved; it now hinges on tokens per watt and the efficiency of power conversion into valuable AI outputs,” he remarked. With AI platforms demanding more power, optimizing energy efficiency and cooling performance is critical for future data centers.

Comprehensive Power Rack Solutions

Additionally, LITEON presented an optimized power rack solution tailored for the ORv3 architecture, featuring an 180kW Power Shelf and a 108kW Capacitor Backup Unit (CBU). This configuration is designed to manage dynamic AI workloads effectively while ensuring system reliability and stability in power delivery. With high-density deployments in mind, LITEON’s solutions include highly compatible liquid cooling modules that promise enhanced thermal performance and design flexibility.

Complete Grid-to-Chip Energy Architecture

Delivering power from the rack to the GPU remains a significant challenge in next-gen AI infrastructures. To combat this, LITEON demonstrated its extensive DC-DC power conversion portfolio, which consists of 800V Power Bricks and various regulating modules. These components facilitate effective electricity delivery across every level, ensuring optimized system stability and reliability.

Strengthening Global Ecosystem Partnerships

In a rapidly evolving landscape of AI computing infrastructure, LITEON is committed to broadening its expertise in power delivery and thermal management. The company is deepening its collaborations with NVIDIA and maintaining strong ties within the OCP community. LITEON’s aim is to address the increasing global demand for robust and scalable AI infrastructures, ultimately aiding in the swift deployment of future AI data centers.

Conclusion

Through its impressive display at the OCP Global Summit 2026, LITEON Technology has made a strong statement about the future of AI infrastructure. By advancing power management, thermal efficiency, and overall infrastructure reliability, LITEON is paving the way for a new era of AI computing that ensures scalability and resilience. As the demand for AI increases, LITEON stands poised to lead the charge in transforming data center capabilities to meet the challenges of today and tomorrow.