#USA #Delta Electronics #Chicago #AI Infrastructure #Cooling Solutions

Delta Electronics Showcases Innovative Cooling Solutions at SC26

Delta Electronics, renowned as a leader in power management and smart green technologies, will be prominently featured at the Supercomputing Conference 2026 (SC26) in Chicago. The company is set to unveil its latest advancements in cooling solutions tailored for artificial intelligence (AI) infrastructures, alongside new power distribution architectures including 800 VDC and ±400 VDC.

Cutting-Edge Cooling Technology for AI Infrastructure

The company’s diverse portfolio will highlight innovative options spanning chip, board, rack, and facility-level applications. One standout product is the 800 VDC-powered, 2.5 MW In-Row Liquid-to-Liquid Coolant Distribution Unit (L2L CDU). This state-of-the-art system is designed to efficiently manage thermal loads within advanced data centers. Additionally, Delta is set to introduce a hot-swappable cold plate solution featuring a modular design for stacked SSDs, enhancing both serviceability and performance in high-density environments.

Notably, Delta’s ultra-thin Multi-Channel Flow Power Shelf Embedded Cold Plate can address cooling demands of up to 3,000W in critical computing components, showcasing the company’s commitment to effective thermal management solutions. Martin Tsai, the General Manager of Fans and Thermal Management Business Group, emphasized that the integration of advanced power and thermal management technologies enables Delta to meet the complex demands posed by AI infrastructures.

Enhanced Cooling at the Chip and Board Levels

Delta's advancements will also be on display at the chip and board levels. Their next-generation cooling technologies incorporate sophisticated thermal interface materials and micro-channel lid structures, which significantly improve thermal management. At the board level, Delta introduces innovative cold plate solutions that extend beyond traditional computing needs, catering specifically to the thermal management concerns of power, memory, and network applications.

The newly showcased Power Shelf Embedded Cold Plate features a unique customizable and ultra-thin design, with flexible manifold layouts that facilitate efficient cooling for hotspots in power systems with limited space. Furthermore, the Vertical Power Delivery (VPD) Double-Sided Cooling Solution designed for Open Adapter Card (OAC) architectures allows for cooling capacities of up to 3,000W for computing components and 500W for power components through a slim 40 mm cold plate profile, achieving heat fluxes exceeding 170 W/cm². With this, Delta aims to provide robust solutions for various applications within modern data centers.

Comprehensive Solutions for Rack and Row-Level Cooling

At the rack level, Delta’s latest 4U In-Rack Coolant Distribution Unit (CDU) can deliver cooling capacities of up to 200 kW. For row-level applications, notable products featured include the Project Deschutes Open In-Row CDU, which offers up to 2 MW of cooling with a 3°C approach temperature, and the Google OCP Project Brazos, a self-contained, closed-loop rack-mounted liquid-to-air CDU that efficiently manages cooling at 60 kW per rack.

Addressing New Challenges in AI Power Distribution

As data centers evolve towards higher-voltage power architectures, the resultant increase in heat generation calls for advanced thermal management solutions. Delta’s exhibition will also cover technologies specifically designed for 800 VDC and ±400 VDC infrastructure. Key highlights include the innovative 800 VDC 2.5 MW In-Row Liquid-to-Liquid CDU, which is equipped with three 800 VDC 25 kW hot-swappable pumps working in a 3+0 configuration, allowing for zero-downtime operation with impressive flow rates of up to 3,850 LPM under 60 psi of pressure.

In the air-cooling department, Delta will be showcasing its next-generation fan wall solution, featuring high-efficiency 450 mm EC blowers, which incorporate brushless DC motors and biomimetic impellers. This advanced technology not only supports high-performance cooling for these sophisticated power architectures but also ensures waterproof protection.

Visit Delta at SC26

Those attending SC26 are warmly invited to visit Delta Electronics at booth #1443 in Chicago’s McCormick Place from November 17 to 19, 2026, to explore their extensive ‘From-Grid-to-Chip’ cooling solutions portfolio. Delta’s experts will be available to discuss thermal management strategies that can enhance efficiency across various sectors, including computing, networking, and power applications.

About Delta Electronics

Delta Electronics (Americas), based in Fremont, CA, has been a key player in power management and smart green solutions for nearly 40 years. With an expansive range of operations across the Americas, Delta serves numerous industries from data centers to industrial automation, continuously providing innovative energy-saving solutions. For further information, visit Delta Electronics or Delta Americas.