#South Korea #Seoul #SK Keyfoundry #LB Semicon #Direct RDL

SK Keyfoundry Collaborates with LB Semicon for Next-Gen Semiconductor Technology

In a significant stride for the semiconductor industry, SK keyfoundry, located in South Korea, has joined forces with LB Semicon to co-develop the Direct Redistribution Layer (RDL) technology. This innovative collaboration aims to revolutionize semiconductor packaging, particularly focusing on the automotive sector, which is increasingly reliant on high-performance chips.

What is Direct RDL?

Direct RDL technology is a cutting-edge semiconductor packaging technique that enhances connectivity and performance by incorporating metal wiring and insulating layers directly atop semiconductor chips. This method, primarily utilized in Wafer Level Packaging (WLP) and Fan-Out Wafer Level Packaging (FOWLP), ensures that electrical connections are robust while minimizing potential signal interference.

By pushing the boundaries of current technology, the newly co-developed Direct RDL by SK keyfoundry and LB Semicon supports power semiconductors equipped with high current capacity. This capability positions it competitively against similar technologies, promising advancements for both mobile and industrial applications, particularly in automotive use.

Superior Performance Specifications

The performance metrics of the Direct RDL technology are impressive. It achieves a metal wiring thickness of up to 15 μm and a wiring density that covers 70% of the chip area. This high level of integration and efficiency is particularly tailored for the automotive industry, where reliability in extreme conditions is paramount.

Significantly, the technology meets the Auto Grade 1 classification under the AEC-Q100 international automotive semiconductor quality standard, ensuring dependable operation in severe environments with temperature tolerances ranging from –40℃ to +125℃. Unlike competitors, this feature guarantees that the technology is fully viable for automotive products.

Tailored Solutions for Industry Needs

In addition to technological prowess, SK keyfoundry is enhancing customer experiences by providing a Design Guide and Process Development Kit tailored to industry needs. This initiative allows for the production of smaller chip sizes, reduced power consumption, and more economical packaging solutions, further cementing SK keyfoundry’s commitment to innovation.

Accelerating Development Timelines

The collaboration between SK keyfoundry and LB Semicon has streamlined the development process. LB Semicon, specializing in semiconductor packaging and testing, has made use of SK keyfoundry’s extensive knowledge of semiconductor processes and advanced manufacturing capabilities. This partnership has effectively shortened the time required for development, setting a new standard for speed and efficiency in the industry.

Statements from Leadership

Namseog Kim, CEO of LB Semicon, highlighted the achievements of this partnership, stating that the successful development of Direct RDL is a significant milestone for both companies. His vision is to establish a firm footing in the next-generation semiconductor packaging market while focusing on high reliability and performance.

Similarly, Derek D. Lee, CEO of SK keyfoundry, expressed pride in the collaboration with LB Semicon. He asserted that this joint venture exemplifies the successful integration of advanced manufacturing expertise into state-of-the-art semiconductor packaging processes. Lee remarked that the goal is to continuously evolve and establish SK keyfoundry as a leading foundry recognized for delivering high-performance and reliable semiconductor solutions globally.

Conclusion

The collaboration between SK keyfoundry and LB Semicon marks an important milestone in the semiconductor landscape, particularly in automotive applications. With the introduction of Direct RDL technology, both companies are setting the stage for advancements that promise to reshape semiconductor packaging standards while meeting the evolving demands of various industries. This partnership not only enhances technological capabilities but also ensures that the automotive semiconductor market remains at the forefront of innovation and reliability.