#Japan #Tokyo #Liquid Cooling #AI servers #CMC Research

Live Seminar Announcement

CMC Research, a provider of advanced technology and market insights, is excited to announce a live seminar titled "Fundamentals and Applications of Liquid Cooling and Immersion Cooling Systems for AI Servers and Data Centers." This seminar will be held on July 28, 2025, starting at 1:30 PM (JST) using Zoom.

The speaker for this event will be Kazuhisa Yuki, a professor at the Yamaguchi Tokyo University of Science in Sanyo-Onoda City. The seminar's fee is set at 44,000 yen (tax included), with a discounted price of 39,600 yen for newsletter subscribers and an academic rate of 26,400 yen. All participants will receive informational materials.

For more details and to register, please visit our website! There will also be a Q&A session, so we encourage you to participate!

Knowledge Gained from the Seminar

Participants will acquire essential knowledge in areas including:

• - Basics of heat transfer engineering necessary for cooling design.
• - Simple cooling design methods using heat transfer correlation equations.
• - Fundamentals of immersion cooling (single-phase cooling, two-phase immersion cooling).
• - Additional thermal implementation challenges (contact thermal resistance, heat spreaders).

Target Audience

This seminar is designed for individuals interested in cooling technologies for data centers.

Seminar Theme and Schedule

• - Theme: Fundamentals and Applications of Liquid Cooling and Immersion Cooling Systems for AI Servers and Data Centers
• - Date and Time: July 28, 2025, from 1:30 PM to 4:30 PM
• - Participation Fee: 44,000 yen (tax included) - Materials included

- Newsletter Subscribers: 39,600 yen (tax included)
- Academic Price: 26,400 yen (tax included)

• - Instructor: Kazuhisa Yuki, Professor at Yamaguchi Tokyo University of Science.

Seminar Objectives

With the emergence of next-generation GPUs that exceed 1,000 watts of power consumption, traditional air cooling methods are reaching their limits. While liquid cooling is gaining traction overseas, similar trends are developing in data center facility design within Japan. Although liquid cooling is employed for AI servers, air cooling still plays a role in existing applications, leading to a complementary use of both systems. This webinar will elucidate the characteristics of air, liquid, and boiling immersion cooling technologies.

We will provide an overview of heat transfer engineering, which is foundational for thermal design, and explain how to predict cooling surface temperatures using heat transfer correlation equations.

Note: This seminar will be conducted via the video conferencing tool, Zoom. Please refer to the recommended environment for using this tool. A separate email will be sent with a URL for viewing after the event. Recording or filming during the seminar is strictly prohibited.

How to Register

Please apply through the seminar site of CMC Research. After registering, a URL for viewing will be sent via email.

Seminar Program Overview

1. Introduction
2. Performance Differences Between Air Cooling, Liquid Cooling, and Immersion Cooling
3. Simple Thermal Design Method Using Heat Transfer Correlation Equations
- Types of heat transfer
- Simple thermal design methods for air and liquid cooling using fans/pumps
4. Immersion Cooling of Electronic Equipment
- Single-phase cooling (oiling cooling, etc.)
- Two-phase immersion cooling
5. Other Thermal Challenges in Electronic Device Implementation
- Contact thermal resistance
- Heat spreaders
6. Conclusion

Speaker Introduction

Kazuhisa Yuki
Yamaguchi Tokyo University of Science

Speaker Credentials

After completing his doctoral studies at Kyushu University in 1998, Professor Yuki spent 11 years at Tohoku University's Graduate School of Engineering. Since 2009, he has been employed at the Faculty of Engineering at Yamaguchi Tokyo University of Science, focusing on cooling research for high heat density electronic devices. His research involves thermal resistance reduction technologies related to cooling inverters for automotive use and data centers.

Activities

Currently, Professor Yuki serves as the chairperson of the Chugoku-Shikoku branch of the Japan Society of Thermal and Fluid Engineering and an executive member of the Japanese Society of Mechanical Engineers' Subcommittee RC301, which aims to revive Japan's electronic manufacturing industry by overseeing the reliability and thermal control of electronic assembly.

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