#Japan #Tokyo #Semiconductor Packaging #Taiyo Holdings #FPIM Series

Taiyo Holdings Unveils Cutting-Edge Semiconductor Packaging Material

Taiyo Holdings Co., Ltd., a prominent player in the semiconductor industry based in Tokyo, recently made significant strides by introducing its latest innovation—the FPIM Series. This next-generation semiconductor packaging material was the focal point during a presentation on September 10, 2026, at the esteemed IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) held in Helsinki, Finland.

The FPIM Series represents a notable advancement in fine-pitch redistribution layer (RDL) technology, specifically designed for dual damascene processes. Co-authored with imec, a leader in semiconductor research, this material is aimed at enabling efficient electrical connections in advanced semiconductor packaging structures.

As the industry trend towards finer pitch wiring continues, the dual damascene process is becoming increasingly essential. This method provides the capability to create wiring with pitches of 1.6 micrometers or smaller. In response, Taiyo Holdings embarked on developing the FPIM Series for this very purpose, having begun joint research with imec in October 2022. The culmination of this collaboration led to the creation of a three-layer RDL structure on a 12-inch wafer featuring a critical dimension (CD) of 1.6 micrometers, unveiled in their previous presentation in November 2025.

During their recent presentation at IEEE ESTC 2026, the effectiveness of this advanced material was demonstrated, where the designed 700-nm CD was achieved for both interconnects and vias on the 12-inch wafers. Notably, the first metal layer (M1) of the structure manifested exceptional electrical characteristics, exhibiting low leakage current and resistance, showing promise for future applications in advanced packaging solutions.

This breakthrough is particularly significant as it not only enhances the interconnect technology but also serves as a platform for developing submicron-class RDL design rules moving forward. Taiyo Holdings has set ambitious goals, aiming to achieve further advancements by realizing RDL formations with CD dimensions of 500 nm or less on wafers, ensuring long-term reliability and electrical performance in the process.

To support the burgeoning semiconductor industry and improvements in AI semiconductor performance, Taiyo Holdings has already initiated the dispatch of small-volume samples of the FPIM Series material for research and development applications since 2025.

The Importance of the RDL in Semiconductor Manufacturing

RDL technology plays a crucial role in semiconductor manufacturing by redistributing electrical wiring on chips to optimize connectivity and performance. Traditionally, RDL structures have relied heavily on the semi-additive process (SAP). However, the emergence of fine-pitch wiring with dual damascene processes represents an evolution in manufacturing capabilities, allowing for more intricate designs and improved circuit efficiency.

In practical terms, the successful establishment of a three-layer RDL structure using the FPIM Series is a testament to the groundbreaking research at Taiyo Holdings and its collaboration with imec. This partnership is founded on shared goals of advancing semiconductor materials and technology. Beginning in late 2022 and continuing with personnel exchanges between the two organizations, the combined expertise is fostering innovative solutions in semiconductor packaging, aiming to reshape how devices are conceived and manufactured.

As Taiyo Holdings continues to explore the limits of semiconductor technology, the potential applications in domains such as AI and high-performance computing remain vast. The successful development and future applications of the FPIM Series can significantly contribute to the industry's evolution, meeting growing demands for sophisticated packaging solutions that drive the next generation of electronic devices forward.

In summary, Taiyo Holdings' advancements in semiconductor packaging technology through the FPIM Series mark a pivotal moment in the industry, setting a new benchmark for material performance and paving the way for future innovations in next-gen electronics. Their commitment to excellence ensures continuous growth and leadership in semiconductor technology, promising exciting developments on the horizon.