#Japan #AI Solutions #Tokyo #DuPont #IC substrates

DuPont Showcases Innovations at JPCA Show 2025

DuPont, a global leader in innovation, is set to make waves at the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025) in Tokyo from June 4 to 6. The company will be located at Booth #6C-03, where it will unveil a diverse array of advanced interconnect solutions critical for the evolving landscape of electronics, particularly in relation to the growing demands of artificial intelligence.

DuPont’s Global Business Director, Yuan Yuan Zhou, emphasized the firm's ongoing commitment to innovation within the electronics sector. “For over 50 years, we have collaborated with industry leaders to power remarkable advancements in electronics,” Zhou stated. The company highlights a focus on advanced circuit packaging, interconnect solutions, and integrated circuit (IC) substrates, all vital for the development of cutting-edge electronics that meet contemporary demands for speed and efficiency.

With AI technology rapidly transforming multiple industries, there is an unprecedented demand for high-quality IC substrates. Japan is playing a pivotal role in developing the innovative materials necessary for these advancements. DuPont’s range of advanced substrates serves as a bridge between AI chips and printed circuit boards (PCBs), facilitating faster data processing and better thermal management. The outlook for the IC substrate market is bright, spurred by a burgeoning AI ecosystem and an increasing need for highly sophisticated electronic solutions.

DuPont’s extensive range of products enables IC substrate manufacturers to accelerate product development and improve manufacturing efficiency. Some key offerings include:

• - DuPont™ Circuposit™ desmear and electroless copper for mSAP (modified Semi-Additive Process) and SAP, which are foundational technologies for PCB fabrication.
• - DuPont™ Copper Gleam™ electrolytic copper for conformal through-hole plating, which enhances core layer plating capacities and efficiency.
• - DuPont™ Microfill™ acid copper, optimizing blind via filling for build-up layers, thereby increasing the efficiency of mSAP and SAP processes.
• - DuPont™ Riston® dry film photoresist, essential for various PCB applications including core and build-up layers and final finishes.

At the show, visitors will have the opportunity to engage with DuPont’s experts and explore integrated solutions tailored for success in the electronics industry, highlighting a complete range of offerings for PCBs.

Among the innovative technologies, Circuposit™ SAP8000 stands out as an advanced metallization technology ideal for AI server CPU and GPU applications. This technology employs an ionic base catalyst process tailored for advanced packaging, meeting the critical demands for low roughness dielectrics and specific dielectric constant (Dk) and dielectric loss (Df) properties necessary for high-frequency designs.

Additionally, Microfill™ SFP-II-M acid copper offers excellent pattern uniformity tailored for high-performance computing and AI chip processing, while Microfill™ GFH-100 acid copper efficiently fills high aspect ratio through-holes, demonstrating unique plating capabilities.

Advanced dry film photoresists like Riston® DI1600 and DI1600M provide outstanding adhesion and resolution for IC substrate applications, further ensuring high-yield performance. DuPont’s Solderon™ TS7000 series solder presents a micro bump plating solution, optimized for mixed and fine pitch applications, enhancing versatility in manufacturing.

Moreover, CYCLOTENE™ dry-film photo-imageable dielectric (DF-PID) simplifies processes for fan-out panel level package applications by achieving coplanarity through a single-step lamination process, distinguishing it from traditional liquid dielectrics that necessitate multiple applications. In addition, Pyralux® ML laminates and Pyralux® AP flexible copper-clad laminates are groundbreaking materials providing OEMs with customizable and reliable solutions for high-performance markets, leveraging polyimide technology to optimize electronic and thermal management applications.

As DuPont continues to lead in the electronic materials field, their innovations are setting new standards and expanding possibilities across critical industries. For interested visitors and stakeholders, engaging with DuPont at JPCA 2025 promises insights into the future of electronics and AI integration, heralding a new era of technological advancement.

About DuPont

DuPont (NYSE: DD) stands as a global innovation powerhouse, championing technology-driven materials and solutions that are vital for transforming industry and everyday life. By harnessing a diverse scope of expertise, DuPont facilitates the transition of customer ideas into integral innovations across various sectors, including electronics, healthcare, and transportation. For more information, please visit www.dupont.com or explore their investor relations online at investors.dupont.com.