#USA #Santa Clara #Automotive #Tenstorrent #Chassis

Tenstorrent Joins the CHASSIS Program

In a significant advancement for the automotive industry, Tenstorrent has revealed its participation in the CHASSIS program, a three-year initiative designed to propel software-defined mobility projects in Europe. This initiative sees Tenstorrent partnering with a consortium of prominent companies and research institutions, including Bosch, BMW Group, and NXP, among others, to enhance automotive chiplet technology.

The CHASSIS program aims to tackle some of the industry’s most pressing challenges by developing scalable, high-performance chiplet platforms specifically for software-defined vehicles (SDVs). Traditional automotive electronic systems often face limitations due to the constraints of combining multiple functions on monolithic System-on-Chips (SoCs). However, chiplet technology offers a solution by allowing rapid customization and reducing both development time and costs associated with integrating technology.

Thaddeus Fortenberry, Head of Autonomy at Tenstorrent, expressed enthusiasm about this collaborative effort: "The CHASSIS program addresses two key aspects simultaneously — it reduces investments by enhancing scaling and improves product quality through a unified approach to die-to-die protocols. We are proud to be an integral part of this advancement."

As leading innovators from Europe's mobility, semiconductor, and software sectors come together, they are not just creating chiplet technology but are also working towards establishing an open chiplet ecosystem. This includes standardization and industrialization efforts supported by various European governments, such as France, Germany, the Netherlands, and the UK, ensuring that this initiative receives the necessary funding.

The benefits of the CHASSIS program extend beyond simply technological advancements. By fostering collaboration among industry leaders and research institutions, the program sets a foundation for future integrations that can enhance the reliability and functionality of SDVs across the continent.

Tenstorrent's role in this collaboration involves the development of chiplet-based hardware architectures for SDVs, which signifies a major step forward in how automotive electronics are conceptualized, integrated, and deployed. The partnership is expected to redefine the future of automotive technology by improving the adaptability and scalability of automotive systems.

As the automotive industry moves towards a software-driven model, Tenstorrent is taking significant steps to ensure that it is at the forefront of innovation. The CHASSIS program represents a commitment to reshaping the mobility landscape, setting a precedent for future collaborations in the semiconductor and automotive sectors.

For more information about the CHASSIS initiative, visit automotive-chiplets.org.

About Tenstorrent

Tenstorrent builds revolutionary computers tailored for AI and the developers shaping its future. With high-performance RISC-V based CPUs and adaptable chiplets, the company provides scalable systems that empower developer innovation — whether for single-node experimentation or extensive data center applications. Committed to an open future, Tenstorrent’s architecture allows for editing, forking, and ownership, setting a new standard in hardware and software convergence.