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GIGABYTE Unveils the X870E AERO X3D WOOD at CES 2026

GIGABYTE TECHNOLOGY Co. Ltd, a prominent global player in the motherboard and hardware solutions market, showcased its newest product, the X870E AERO X3D WOOD, at CES 2026. This innovative motherboard merges high-performance technology with aesthetic appeal tailored to modern living and working spaces.

A New Era in PC Design

As personal computers increasingly find their homes in open living environments, GIGABYTE's latest offering aims to redefine how we perceive computer hardware. The X870E AERO X3D WOOD is not just a piece of technology; it is a design statement that infuses warmth and sophistication into high-end systems. Its appearance allows it to blend seamlessly into lifestyle-oriented PC setups, challenging the conventional notion that hardware needs to be hidden away.

Aesthetic Innovations

The design of the X870E AERO X3D WOOD takes inspiration from natural materials, featuring wood-inspired accents and a high-end leather strap. This combination not only enhances its visual appeal but also provides a tactile experience that is uncommon in standard PC components. This motherboard is crafted specifically for enthusiasts, creatives, and gamers who appreciate both aesthetics and functionality.

Performance-Driven by AMD X3D Technology

Beneath its refined exterior lies a powerhouse. The X870E AERO X3D WOOD is built on the AMD Socket AM5 platform and is compatible with the latest Ryzen™ series processors, including the 9000, 8000, and 7000 series. It enhances X3D performance with the AI-boosted X3D Turbo Mode 2.0, ensuring that users enjoy outstanding performance alongside its striking design.

The motherboard also supports DDR5 memory overclocking up to 9000 MT/s and features a robust digital VRM design with 16+2+2 phases, ensuring stable and efficient power delivery under demanding conditions. Additionally, it boasts two PCIe 5.0 slots for graphics cards, alongside four M.2 slots that support both PCIe 5.0 and 4.0 x4 for ultra-fast storage capabilities.

Advanced Thermal Management

To maintain top performance, the X870E AERO X3D WOOD includes advanced thermal solutions designed to be both efficient and visually appealing. Key thermal features of the motherboard include:

• - VRM Thermal Armor Advanced: Utilizes high-efficiency heat pipes to dissipate heat effectively.
• - M.2 Thermal Guard: Ensures the cool operation of SSDs through specially designed thermal circuits.
• - PCB Heat Plate: Improves thermal performance by 14% while reinforcing structural stability.

Cutting-Edge Connectivity Features

This motherboard doesn’t skimp on connectivity either. It is equipped with two 5 GbE LAN ports, Wi-Fi 7 capabilities, and includes two USB4 Type-C ports that support both DisplayPort Alt Mode and HDMI. Further enhancing the user experience are several GIGABYTE innovations:

• - DriverBIOS: Pre-installed Wi-Fi drivers for immediate network access right out of the box.
• - M.2 EZ-Flex: A flexible, patented baseplate that enhances SSD cooling.
• - WIFI EZ-Plug and M.2 EZ-Latch Click Plus: Simplifies antenna installation and tool-free SSD installation, respectively.

Conclusion

In conclusion, the GIGABYTE X870E AERO X3D WOOD represents a significant leap in high-performance motherboard design, where elegance meets uncompromised functionality. As we embrace a more integrated lifestyle where technology and design coexist, this motherboard stands out as a perfect example of how advanced engineering can complement the aesthetics of our living spaces. For more information and to order, visit the official GIGABYTE website.