#Singapore #Automotive Supply Chain #Chiplet Technology #Silicon Box

Silicon Box Partners with Imec for Automotive Chiplet Advancement

In a significant move aimed at revolutionizing the automotive chip sector, Silicon Box, recognized as a leader in advanced semiconductor packaging, has officially joined imec’s Automotive Chiplet Program (ACP). This collaborative initiative is dedicated to accelerating the development and adoption of chiplet technology, which is essential for the evolution of next-generation vehicles.

The automotive industry today faces a myriad of challenges, especially concerning the rising costs and increasing demand for computing power in modern vehicles, which are increasingly defined by sophisticated software. Recognizing the pivotal nature of chiplet technology, Silicon Box is set to provide its extensive expertise in chiplet interconnections. This will encompass a wide array of services from architectural consulting to end-to-end packaging and testing solutions.

The Role of Chiplet Technology in Automotive Development

Chiplet technology is gaining traction owing to its potential to alleviate high costs and address supply chain bottlenecks — issues that stem from rapidly escalating computational requirements for today's digitally advanced vehicles. The integration of chiplets allows for flexible and scalable designs that can cater to the complex needs of autonomous and connected driving capabilities.

Dr. BJ Han, co-founder and CEO of Silicon Box, emphasized the importance of this collaborative step. He stated, “The ACP is a tremendous leap forward for the burgeoning chiplet ecosystem. The automotive sector, a cornerstone of Europe’s industrial capabilities, is acknowledging the advantages of chiplet technology and committing to its accelerated development.”

To support the ACP’s research aims, Silicon Box will utilize its proprietary advanced packaging methods to bring practical outcomes, including the development of interoperability standards for automotive chiplets. The ACP consortium, which includes over 22 distinct industry partners, aims to establish guidelines that ensure compatibility and reliability while also meeting stringent automotive safety and thermal standards.

Enhancing Automotive Chip Development

Key initiatives within the ACP will involve:

• - Automotive Chiplet Interoperability: Reviewing architectures and defining protocols that satisfy the demanding safety and performance criteria of the automotive realm.
• - Advanced Packaging Research: Supporting packaging developments to guarantee that chiplet connections adhere to high automotive quality benchmarks.

About this initiative, Mike Han, Chief Revenue Officer at Silicon Box, noted, “Advanced packaging technology is crucial for allowing seamless upgrades through flexible interconnections between chiplets, thereby meeting the high computational demands of modern automotive systems which are far beyond the traditional single-chip frameworks.”

Roadmap for Silicon Box in Automotive Sector

At the recently held ACP Forum, Dr. Han presented insights about how advanced packaging techniques can cater to the high-performance requirements of autonomous driving. Silicon Box is already collaborating with various customers to co-develop chiplet-based packages specifically tailored for advanced driver assistance systems (ADAS).

Recently, Silicon Box achieved remarkable growth, with automotive customer revenues soaring at an annualized rate of 436% in Q1 of 2026, underscoring the importance of the automotive industry in the company’s overall strategy. Furthermore, Silicon Box’s Singapore facility recently hit a milestone of 100 million units produced, showcasing the viability of their panel-level packaging technology for the chiplet era.

In alignment with Europe's ambition to boost semiconductor manufacturing, Silicon Box is also on track to establish a second facility in Novara, Italy, which is set to replicate its successful packaging and testing processes while establishing a complete semiconductor value chain. This site aims to contribute to Europe meeting its goal of producing 20% of global semiconductor needs by 2030.

Conclusion

The collaboration between Silicon Box and imec marks a pivotal moment for the automotive industry and semiconductor technology. As the demand for smarter, safer vehicles continues to surge, innovations like chiplet technology will be essential in fulfilling future automotive needs. The progress made through the ACP will likely shape the next era of automotive technology, offering exciting potential for manufacturers and consumers alike. To learn more about Silicon Box and its initiatives, visit silicon-box.com.