Boosting Semiconductor Packaging Capacity
In order to meet the increasing demand for semiconductor packaging materials in China - spurred by the rapid spread of generative AI and other technological developments - Sumitomo Bakelite Co., Ltd., headquartered in Shinagawa, Tokyo, has announced an expansion of production capacity at its group company, Su Zhou Sumitomo Electric Resin Co., Ltd.
Background of Semiconductor Packaging Production
Sumitomo Bakelite commenced semiconductor packaging material production in China in 1997. Since then, the company has consistently expanded its operations, including the addition of a production line to its current factory in March 2022 and plans for a new factory that is set to start operations in 2025. The semiconductor market in China is experiencing significant growth due to increased demand across various fields, including AI, IoT, 5G-related devices, and electric vehicles. In particular, the rapid adoption of generative AI has led to a sharp rise in demand for components such as GPUs, memory, and power semiconductors for AI data centers.
Upcoming Factory Expansion
With an eye towards further market expansion, Su Zhou Sumitomo Electric plans to add production lines which will boost its production capacity in China by approximately 30%. This initiative is expected to commence in December 2028.
Sumitomo Bakelite's group consists of semiconductor packaging production bases not only in Japan and China but also in Singapore, Taiwan, and Belgium. This wide geographical spread aims to ensure a stable supply to key markets. Through the enhancement of production capacity in China, the company is committed to solidifying its supply framework of high-functionality and high-quality products in next-generation semiconductor fields, particularly those related to AI, thus reinforcing its presence as a leading company in the semiconductor packaging industry.
Overview of Su Zhou Sumitomo Electric
- - Location: Su Zhou, Jiangsu Province, China
- - Site Area: Approximately 60,000 square meters
- - Main Products: Epoxy resin molding materials for semiconductor packaging
For more inquiries regarding this matter, please contact:
Information and Communication Materials Sales Division,
Phone: 03-5462-4015
Inquiry Form:
Inquiry Form